MPC8270ZQMIBA

The MPC8270ZQMIBA is a PowerPC G2_LE based embedded microprocessor IC featuring a single 32-bit core running at 333 MHz and supplied in a 516-PBGA (27×27) package. It is part of the MPC8270 series and targets embedded and communications-focused designs that require integrated networking interfaces and memory controllers.

Designed for consumer-qualified embedded applications, this device combines a dual-issue integer G2_LE core architecture with on-chip controllers for DRAM/SDRAM and multiple connectivity options to reduce BOM complexity and accelerate system integration.

Key Features

• Core PowerPC G2_LE architecture with a single 32-bit core running at 333 MHz; the family documentation identifies the core as a dual-issue integer (G2_LE) design with separate 16 KB instruction and 16 KB data caches.
• Memory Support On-chip controllers for DRAM and SDRAM to support system memory interfacing and simplify board design.
• Connectivity Three 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low-rate port provide multiple native networking options; additional I2C interface supports peripheral control and sensor connectivity.
• Co-processor and Communication Support Integrated communications co-processors including RISC CPM and communications-oriented blocks to support protocol handling and offloaded packet processing.
• Package & Mounting 516-PBGA supplier device package (27×27) in a surface-mount format for high-density board designs.
• Power and I/O 3.3 V I/O signaling to match common embedded peripherals and interfaces.
• Thermal Operating temperature range from 0 °C to 105 °C suitable for consumer-class embedded environments with elevated temperature tolerance.
• Compliance RoHS compliant.

Typical Applications

• Embedded Communications Equipment Use the on-chip Ethernet ports and communications co-processors for networking modules and embedded routers or gateways in consumer-grade systems.
• Connectivity Modules USB 2.0 and I2C interfaces enable integration into consumer connectivity hubs, peripheral controllers, and media devices.
• Consumer Embedded Systems Consumer-qualified operation and a compact 516-PBGA package make the part suitable for space-constrained consumer electronics requiring network connectivity and moderate processing performance.

Unique Advantages

• Integrated Networking Interfaces: Three 10/100 Mbps Ethernet ports and a USB 2.0 port reduce the need for external chips when implementing connectivity features.
• On-chip Memory Controllers: Built-in DRAM/SDRAM controllers simplify memory subsystem design and lower overall BOM count.
• Compact PBGA Packaging: 516-PBGA (27×27) package provides a high-density footprint for embedded designs where board space is limited.
• Robust Thermal Range for Consumer Use: Rated 0 °C to 105 °C to accommodate elevated-temperature consumer environments.
• 3.3 V I/O Compatibility: Standard 3.3 V I/O supports broad compatibility with common embedded peripherals and interfaces.
• RoHS Compliance: Environmentally compliant manufacturing to meet regulatory requirements for lead-free designs.

Why Choose MPC8270ZQMIBA?

The MPC8270ZQMIBA combines a PowerPC G2_LE core with integrated communications features and memory controllers to deliver a compact, connectivity-focused embedded processing solution. Its 333 MHz single-core performance, multi-port Ethernet, USB 2.0, and on-chip DRAM/SDRAM controllers make it well suited to consumer-grade embedded and communications applications where integration and board space matter.

Backed by NXP Semiconductors' MPC8270 family documentation and delivered in a 516-PBGA surface-mount package, this device provides a balanced mix of processing capability and peripheral integration for developers building consumer embedded systems with native networking requirements.

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