MPC8271CVRMIBA

IC MPU MPC82XX 266MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27)

Quantity 785 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8271
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8271CVRMIBA – IC MPU MPC82XX 266MHZ PBGA516

The MPC8271CVRMIBA is a PowerQUICC II family microprocessor featuring a PowerPC G2_LE 32-bit core operating at 266 MHz. Designed as an integrated communications-oriented embedded MPU, it provides on-chip controllers and interfaces tailored for networking and industrial embedded applications where robust I/O and industrial temperature capability are required.

Key Features

  • Core – PowerPC G2_LE 32-bit processor core, dual-issue integer architecture with a 266 MHz operating frequency for deterministic embedded compute.
  • Caches – On-chip instruction and data caches (16 KB I-cache, 16 KB D-cache) to improve instruction throughput and data access latency.
  • Memory Controllers – Integrated DRAM and SDRAM controllers for flexible system memory interfacing.
  • Communications Co-processors – Includes communications and RISC CPM co-processors to offload protocol handling and real-time serial tasks.
  • Networking Interfaces – Dual 10/100 Mbps Ethernet controllers and one USB 2.0 full/low-speed port for networked and peripheral connectivity.
  • Additional Interfaces – I2C interface available for low-speed control and configuration tasks.
  • Power and I/O – 3.3 V I/O signaling to match common embedded system voltage domains.
  • Package and Mounting – 516-pin PBGA surface-mount package (27 × 27 mm) for high-pin-count board designs.
  • Qualification and Temperature – Industrial qualification with an operating temperature range of −40 °C to 105 °C for harsh environments.
  • Compliance – RoHS compliant.

Typical Applications

  • Networking & Communications Equipment – Dual 10/100 Ethernet and communications CPM co-processors enable protocol handling and packet processing for routers, switches, and access devices.
  • Industrial Embedded Systems – Industrial temperature rating and robust package make it suitable for factory automation controllers and field instrumentation.
  • USB-Enabled Devices – USB 2.0 support allows integration of peripheral connectivity in embedded designs requiring host or device USB functionality.
  • Memory-Intensive Embedded Designs – On-chip DRAM/SDRAM controllers support systems that require external memory for buffering and runtime data.

Unique Advantages

  • Integrated Communications-Oriented Design: Combines a PowerPC core with communications co-processors and dual Ethernet controllers to reduce external components and simplify system architecture.
  • Balanced Performance and Efficiency: 266 MHz PowerPC G2_LE core with 16 KB instruction and data caches delivers predictable embedded processing performance for control and networking tasks.
  • Wide Operating Temperature Range: −40 °C to 105 °C qualification supports deployment in demanding industrial environments.
  • Flexible Memory Support: On-chip DRAM and SDRAM controllers enable straightforward memory expansion and high-throughput buffering for communications workloads.
  • High-Pin-Count PBGA Package: 516-pin (27 × 27 mm) PBGA offers extensive I/O routing for complex embedded systems while supporting surface-mount assembly.
  • Standards-Aligned I/O Levels and Compliance: 3.3 V I/O and RoHS compliance align with common embedded system design practices and regulatory requirements.

Why Choose MPC8271CVRMIBA?

The MPC8271CVRMIBA positions itself as a communications-focused embedded MPU that combines a PowerPC G2_LE core, dedicated communications co-processors, and multiple Ethernet and USB interfaces in a single 516‑pin PBGA package. Its industrial qualification and −40 °C to 105 °C operating range make it suitable for systems that require reliable operation in challenging environments.

This device is well suited to designers who need integrated networking capabilities, flexible memory interfacing, and a compact, high-pin-count package to reduce BOM complexity and streamline system integration while maintaining control over performance and thermal constraints.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC8271CVRMIBA and to discuss how it fits your embedded design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up