MPC8271CVRMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 785 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8271 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8271CVRMIBA – IC MPU MPC82XX 266MHZ PBGA516
The MPC8271CVRMIBA is a PowerQUICC II family microprocessor featuring a PowerPC G2_LE 32-bit core operating at 266 MHz. Designed as an integrated communications-oriented embedded MPU, it provides on-chip controllers and interfaces tailored for networking and industrial embedded applications where robust I/O and industrial temperature capability are required.
Key Features
- Core – PowerPC G2_LE 32-bit processor core, dual-issue integer architecture with a 266 MHz operating frequency for deterministic embedded compute.
- Caches – On-chip instruction and data caches (16 KB I-cache, 16 KB D-cache) to improve instruction throughput and data access latency.
- Memory Controllers – Integrated DRAM and SDRAM controllers for flexible system memory interfacing.
- Communications Co-processors – Includes communications and RISC CPM co-processors to offload protocol handling and real-time serial tasks.
- Networking Interfaces – Dual 10/100 Mbps Ethernet controllers and one USB 2.0 full/low-speed port for networked and peripheral connectivity.
- Additional Interfaces – I2C interface available for low-speed control and configuration tasks.
- Power and I/O – 3.3 V I/O signaling to match common embedded system voltage domains.
- Package and Mounting – 516-pin PBGA surface-mount package (27 × 27 mm) for high-pin-count board designs.
- Qualification and Temperature – Industrial qualification with an operating temperature range of −40 °C to 105 °C for harsh environments.
- Compliance – RoHS compliant.
Typical Applications
- Networking & Communications Equipment – Dual 10/100 Ethernet and communications CPM co-processors enable protocol handling and packet processing for routers, switches, and access devices.
- Industrial Embedded Systems – Industrial temperature rating and robust package make it suitable for factory automation controllers and field instrumentation.
- USB-Enabled Devices – USB 2.0 support allows integration of peripheral connectivity in embedded designs requiring host or device USB functionality.
- Memory-Intensive Embedded Designs – On-chip DRAM/SDRAM controllers support systems that require external memory for buffering and runtime data.
Unique Advantages
- Integrated Communications-Oriented Design: Combines a PowerPC core with communications co-processors and dual Ethernet controllers to reduce external components and simplify system architecture.
- Balanced Performance and Efficiency: 266 MHz PowerPC G2_LE core with 16 KB instruction and data caches delivers predictable embedded processing performance for control and networking tasks.
- Wide Operating Temperature Range: −40 °C to 105 °C qualification supports deployment in demanding industrial environments.
- Flexible Memory Support: On-chip DRAM and SDRAM controllers enable straightforward memory expansion and high-throughput buffering for communications workloads.
- High-Pin-Count PBGA Package: 516-pin (27 × 27 mm) PBGA offers extensive I/O routing for complex embedded systems while supporting surface-mount assembly.
- Standards-Aligned I/O Levels and Compliance: 3.3 V I/O and RoHS compliance align with common embedded system design practices and regulatory requirements.
Why Choose MPC8271CVRMIBA?
The MPC8271CVRMIBA positions itself as a communications-focused embedded MPU that combines a PowerPC G2_LE core, dedicated communications co-processors, and multiple Ethernet and USB interfaces in a single 516‑pin PBGA package. Its industrial qualification and −40 °C to 105 °C operating range make it suitable for systems that require reliable operation in challenging environments.
This device is well suited to designers who need integrated networking capabilities, flexible memory interfacing, and a compact, high-pin-count package to reduce BOM complexity and streamline system integration while maintaining control over performance and thermal constraints.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC8271CVRMIBA and to discuss how it fits your embedded design requirements.

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