MPC8271CZQTIEA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 813 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8271 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 400MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8271CZQTIEA – IC MPU MPC82XX 400MHZ PBGA516
The MPC8271CZQTIEA is a PowerPC G2_LE based 32-bit microprocessor delivering a 400 MHz core in a 516-pin PBGA (27×27) surface-mount package. Designed for embedded applications, this industrially qualified MPU integrates communications-oriented co-processing and memory control to support networked and control-oriented systems.
With on-chip communications support, multiple Ethernet ports and standard peripheral interfaces, the device targets embedded communications, industrial networking and control applications where integration, deterministic operation and extended temperature range are required.
Key Features
- Core and Performance Dual-issue PowerPC G2_LE 32-bit core running at 400 MHz, providing deterministic processing for embedded workloads.
- Caches Separate instruction and data caches (16 KB I-cache and 16 KB D-cache) as specified for the MPC82xx family, improving instruction and data throughput.
- Co-processors and CPM Integrated communications co-processors including a RISC Communications Processor Module (CPM) and communications DSP capabilities for protocol offload and packet handling.
- Memory Controllers On-chip DRAM and SDRAM controllers to simplify external memory interfacing and system memory design.
- Networking and I/O Dual 10/100 Mbps Ethernet interfaces and a USB 2.0 interface, plus I2C for system management and peripheral control.
- Industrial Qualification Qualified for industrial use with an operating temperature range of −40 °C to 105 °C and RoHS compliance.
- Package and Mounting 516-PBGA (27×27) supplier device package, surface-mount mounting type, suitable for compact embedded PCBs.
- Voltage I/O 3.3 V I/O signaling to match common embedded system levels.
Typical Applications
- Industrial Networking Equipment Dual 10/100 Mbps Ethernet and integrated communications co-processors enable routers, switches and industrial gateways.
- Embedded Communications Modules CPM and DSP communications offload make the device suitable for protocol converters, VoIP interfaces and telecommunications modules.
- Networked Control Systems Industrial temperature rating and deterministic PowerPC processing support machine controllers and distributed I/O systems.
- Appliances with Network Interfaces On-chip USB and Ethernet simplify implementation of networked appliances and instrumentation with external DRAM/SDRAM.
Unique Advantages
- High-performance PowerPC Core: 400 MHz G2_LE core delivers the processing bandwidth needed for real-time embedded tasks.
- Integrated Communications Engine: CPM and communications DSP functionality reduce host load and lower system-level controller requirements.
- Dual Ethernet Interfaces: Two 10/100 Mbps Ethernet ports provide native network connectivity for redundant or dual-network designs.
- Memory Interface Flexibility: DRAM and SDRAM controllers on-chip simplify board design and speed time to market.
- Industrial-grade Reliability: −40 °C to 105 °C operating range and industrial qualification support deployment in harsh environments.
- Compact PBGA Footprint: 516-PBGA (27×27) package enables a high-pin-count solution in a compact surface-mount form factor.
Why Choose MPC8271CZQTIEA?
The MPC8271CZQTIEA combines a deterministic PowerPC G2_LE core with integrated communications processing, memory controllers and a compact high-pin-count PBGA package, positioning it as a strong choice for embedded and industrial networking designs. Its combination of interfaces—dual Ethernet, USB and I2C—alongside DRAM/SDRAM support reduces external component count and simplifies system architecture.
Backed by NXP Semiconductors’ MPC82xx family heritage, the device offers a pragmatic balance of performance, integration and industrial-grade operation for designers building networked controllers, gateways and communications modules that require predictable performance and robust thermal tolerance.
Request a quote or submit a volume inquiry to receive pricing and availability for MPC8271CZQTIEA.

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