MPC8271CZQTIEA

IC MPU MPC82XX 400MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)

Quantity 813 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8271
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed400MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8271CZQTIEA – IC MPU MPC82XX 400MHZ PBGA516

The MPC8271CZQTIEA is a PowerPC G2_LE based 32-bit microprocessor delivering a 400 MHz core in a 516-pin PBGA (27×27) surface-mount package. Designed for embedded applications, this industrially qualified MPU integrates communications-oriented co-processing and memory control to support networked and control-oriented systems.

With on-chip communications support, multiple Ethernet ports and standard peripheral interfaces, the device targets embedded communications, industrial networking and control applications where integration, deterministic operation and extended temperature range are required.

Key Features

  • Core and Performance  Dual-issue PowerPC G2_LE 32-bit core running at 400 MHz, providing deterministic processing for embedded workloads.
  • Caches  Separate instruction and data caches (16 KB I-cache and 16 KB D-cache) as specified for the MPC82xx family, improving instruction and data throughput.
  • Co-processors and CPM  Integrated communications co-processors including a RISC Communications Processor Module (CPM) and communications DSP capabilities for protocol offload and packet handling.
  • Memory Controllers  On-chip DRAM and SDRAM controllers to simplify external memory interfacing and system memory design.
  • Networking and I/O  Dual 10/100 Mbps Ethernet interfaces and a USB 2.0 interface, plus I2C for system management and peripheral control.
  • Industrial Qualification  Qualified for industrial use with an operating temperature range of −40 °C to 105 °C and RoHS compliance.
  • Package and Mounting  516-PBGA (27×27) supplier device package, surface-mount mounting type, suitable for compact embedded PCBs.
  • Voltage I/O  3.3 V I/O signaling to match common embedded system levels.

Typical Applications

  • Industrial Networking Equipment  Dual 10/100 Mbps Ethernet and integrated communications co-processors enable routers, switches and industrial gateways.
  • Embedded Communications Modules  CPM and DSP communications offload make the device suitable for protocol converters, VoIP interfaces and telecommunications modules.
  • Networked Control Systems  Industrial temperature rating and deterministic PowerPC processing support machine controllers and distributed I/O systems.
  • Appliances with Network Interfaces  On-chip USB and Ethernet simplify implementation of networked appliances and instrumentation with external DRAM/SDRAM.

Unique Advantages

  • High-performance PowerPC Core: 400 MHz G2_LE core delivers the processing bandwidth needed for real-time embedded tasks.
  • Integrated Communications Engine: CPM and communications DSP functionality reduce host load and lower system-level controller requirements.
  • Dual Ethernet Interfaces: Two 10/100 Mbps Ethernet ports provide native network connectivity for redundant or dual-network designs.
  • Memory Interface Flexibility: DRAM and SDRAM controllers on-chip simplify board design and speed time to market.
  • Industrial-grade Reliability: −40 °C to 105 °C operating range and industrial qualification support deployment in harsh environments.
  • Compact PBGA Footprint: 516-PBGA (27×27) package enables a high-pin-count solution in a compact surface-mount form factor.

Why Choose MPC8271CZQTIEA?

The MPC8271CZQTIEA combines a deterministic PowerPC G2_LE core with integrated communications processing, memory controllers and a compact high-pin-count PBGA package, positioning it as a strong choice for embedded and industrial networking designs. Its combination of interfaces—dual Ethernet, USB and I2C—alongside DRAM/SDRAM support reduces external component count and simplifies system architecture.

Backed by NXP Semiconductors’ MPC82xx family heritage, the device offers a pragmatic balance of performance, integration and industrial-grade operation for designers building networked controllers, gateways and communications modules that require predictable performance and robust thermal tolerance.

Request a quote or submit a volume inquiry to receive pricing and availability for MPC8271CZQTIEA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up