MPC8271ZQTIEA

IC MPU MPC82XX 400MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)

Quantity 721 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8271
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed400MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8271ZQTIEA – PowerPC G2_LE 400MHz 32‑Bit Microprocessor

The MPC8271ZQTIEA is a single‑core PowerPC G2_LE microprocessor delivering a 400 MHz operating frequency in a compact 516‑PBGA (27×27) package. Designed for embedded and communications-focused systems, it combines a high‑performance integer core with on‑chip communications processing and memory controller support to simplify system design.

As a member of the PowerQUICC II family, this device targets embedded networking, consumer and industrial applications that require integrated Ethernet, USB and DRAM/SDRAM interfacing while operating from a 3.3 V I/O domain and an ambient range up to 105 °C.

Key Features

  • Core PowerPC G2_LE single‑core, dual‑issue integer architecture, 32‑bit, running at 400 MHz for deterministic embedded processing.
  • On‑chip caches 16 KB instruction cache and 16 KB data cache as documented for the PowerQUICC II family, improving instruction throughput and data locality.
  • Communications and co‑processing Integrated Communications Processor Module (CPM) and communications‑focused co‑processors (RISC CPM) to handle protocol and I/O tasks.
  • Memory controllers On‑chip DRAM and SDRAM controller support to simplify external memory interfacing and system memory architecture.
  • High‑speed interfaces Dual 10/100 Mbps Ethernet ports and one USB 2.0 full/low‑rate port provide wired connectivity for networking and peripheral attachment.
  • System interfaces Additional I2C interface and multi‑channel serial controllers suitable for board control, sensors and peripheral management.
  • Voltage and mounting 3.3 V I/O signaling with a surface‑mount 516‑PBGA (27×27) package for high‑density board layouts.
  • Operating range and qualification Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance for regulatory alignment.

Typical Applications

  • Networking & Communications Dual 10/100 Mbps Ethernet and CPM co‑processing make the MPC8271ZQTIEA well suited for routers, switches and communication modules that require onboard packet handling and protocol processing.
  • Embedded Control Systems On‑chip DRAM/SDRAM controllers and a deterministic 400 MHz core enable responsive control in industrial and automation equipment.
  • Consumer and Commercial Devices USB 2.0 connectivity and broad peripheral support are useful for consumer electronics and commercial appliances that need moderate processing and connectivity.
  • System Integration Platforms Compact 516‑PBGA packaging and integrated communication peripherals simplify BOM and board‑level integration for compact embedded platforms.

Unique Advantages

  • Integrated communications capability: Dual 10/100 Ethernet ports, USB 2.0 and a dedicated CPM reduce external controller requirements and streamline board design.
  • Balanced performance and determinism: A 400 MHz PowerPC G2_LE core with on‑chip caches provides responsive control and predictable execution for embedded workloads.
  • Memory subsystem support: Built‑in DRAM/SDRAM controllers simplify memory interfacing and enable straightforward system memory configurations.
  • Compact, high‑density package: 516‑PBGA (27×27) surface‑mount package supports dense PCB layouts while maintaining extensive I/O.
  • Commercial readiness and compliance: Consumer qualification and RoHS compliance align the device with commercial product requirements and environmental regulations.
  • Broad embedded peripheral set: I2C, serial controllers and co‑processor support enable flexible interfacing for sensors, peripherals and protocol handling.

Why Choose MPC8271ZQTIEA?

The MPC8271ZQTIEA positions itself as a compact, communications‑oriented embedded processor delivering a 400 MHz PowerPC G2_LE core combined with integrated communications engines and memory controllers. This combination reduces external components, shortens development time and supports robust embedded networking and control applications.

It is well suited to designers building consumer and commercial embedded systems that require Ethernet and USB connectivity, direct DRAM/SDRAM interfacing, and reliable operation within a 0 °C to 105 °C range. RoHS compliance and a standardized PBGA package further support scalable production and assembly workflows.

Request a quote or submit a sales inquiry to evaluate MPC8271ZQTIEA for your next embedded or communications design.

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