MPC8271ZQMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 202 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8271 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8271ZQMIBA – IC MPU MPC82XX 266MHZ PBGA516
The MPC8271ZQMIBA is a PowerPC G2_LE based microprocessor IC configured as a single 32-bit core operating at 266 MHz. Designed for embedded systems, it combines a high-efficiency PowerPC core with dedicated communications hardware and mainstream memory interfaces to address compact networking and control applications.
With integrated communications support and multiple standard I/O options, this device targets embedded communications, industrial control and networking applications where integration, deterministic performance and robust I/O are required.
Key Features
- Core Dual-issue PowerPC G2_LE integer core; single 32-bit core operating at 266 MHz (family frequency range documented at 266–400 MHz).
- Memory On-chip support for memory controllers including DRAM and SDRAM; family documentation indicates separate instruction and data caches (16 KB I-cache and 16 KB D-cache for the series).
- Communications & Co‑processors Integrated communications co-processors including CPM (RISC) and communications DSP capabilities to accelerate protocol and packet handling.
- Connectivity Dual 10/100 Mbps Ethernet ports (2), one USB 2.0 controller, and I2C interface provide versatile external connectivity for networking and peripheral integration.
- Package & Mounting 516‑ball PBGA package (27 × 27 mm), surface-mount mounting type; package case listed as 516‑BBGA / 516‑PBGA.
- Power & I/O Voltage I/O voltage specified at 3.3 V for common system interfacing.
- Environmental & Operating Range RoHS compliant; operating temperature range specified at 0 °C to 105 °C.
Typical Applications
- Embedded Networking Use in compact routers, switches or network appliances where dual 10/100 Ethernet and integrated communications engines simplify packet processing.
- Industrial Control Suitable for embedded controllers and gateway devices that require deterministic processor performance and standard memory interfaces (DRAM/SDRAM).
- Communications Equipment Ideal for protocol handling and communications tasks leveraging the CPM and communications co-processor architecture.
- Peripheral Hubs USB 2.0 and I2C support allow integration as a control or connectivity hub within larger embedded systems.
Unique Advantages
- Highly integrated communications capability: On-chip CPM and communications DSP elements reduce external logic and simplify BOM for networking-focused designs.
- Proven PowerPC G2_LE core: Dual-issue integer core architecture provides deterministic 32-bit processing at 266 MHz for embedded workloads.
- Flexible connectivity suite: Dual 10/100 Ethernet, USB 2.0 and I2C interfaces enable diverse peripheral and networking configurations without additional bridge components.
- Standard memory support: Built-in DRAM and SDRAM controllers ease system memory integration and layout.
- Compact PBGA package: 516‑ball PBGA (27 × 27 mm) enables high I/O density in a surface-mount form factor suitable for space-constrained boards.
- Compliance and thermal range: RoHS compliance and an operating range from 0 °C to 105 °C support typical commercial and industrial embedded deployments.
Why Choose MPC8271ZQMIBA?
The MPC8271ZQMIBA positions itself as a compact, communications-focused embedded processor combining a PowerPC G2_LE core with dedicated communications engines and mainstream I/O. Its 266 MHz operating point, integrated Ethernet and USB interfaces, and DRAM/SDRAM support make it well suited to designers building embedded networking, control or communications products that benefit from integrated packet handling and versatile peripheral connectivity.
For teams seeking a single-chip solution that balances processing capability, communications integration and a high-density PBGA package, the MPC8271ZQMIBA delivers verifiable specifications and regulatory compliance to streamline system design and deployment.
Request a quote or submit an inquiry to receive pricing and availability details for the MPC8271ZQMIBA and to discuss how this device can fit into your embedded design requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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