MPC8260AZUPJDB-NXP

The MPC8260AZUPJDB-NXP is a single-core PowerPC G2 microprocessor operating at 300 MHz, designed for embedded applications. It integrates communication-focused co-processors and memory controllers to support systems that require on-chip networking and DRAM/SDRAM interfacing.

Manufactured by NXP Semiconductors and qualified for consumer applications, this device offers a 3.3 V I/O domain, multiple Ethernet interfaces, and a compact 480-TBGA package for surface-mount assembly.

Key Features

• Core and Performance PowerPC G2 single-core, 32-bit processor running at 300 MHz suitable for embedded control and processing tasks.
• Co-processors Integrated communications DSP and RISC CPM co-processors to offload and accelerate communication-related tasks.
• Memory Subsystem On-chip controllers for DRAM and SDRAM to support external system memory configurations.
• Ethernet Interfaces Three 10/100 Mbps Ethernet interfaces for wired network connectivity and communications integration.
• Peripheral Interfaces Includes I2C for system control and peripheral management.
• Power and I/O 3.3 V I/O voltage domain for compatibility with common embedded peripherals.
• Package and Mounting 480-TBGA supplier device package (37.5×37.5 mm) in a 480-LBGA exposed pad case designed for surface-mount assembly.
• Operating Range and Qualification Consumer-qualified device rated for operation from 0°C to 105°C and RoHS compliant.

Typical Applications

• Embedded consumer devices — Suitable for consumer-class embedded systems requiring a stable PowerPC G2 core and peripheral integration.
• Networking and communications equipment — Three 10/100 Mbps Ethernet ports and communications co-processors enable integration into networked devices.
• Memory-driven embedded systems — DRAM and SDRAM controllers support applications that require external system memory.

Unique Advantages

• Integrated communications co-processors: On-chip DSP and RISC CPM reduce external component count for communication functions.
• Multiple Ethernet ports: Three 10/100 Mbps interfaces provide native wired networking capability without additional PHY management.
• Compact, manufacturable package: 480-TBGA (37.5×37.5 mm) with exposed pad in a surface-mount form factor simplifies PCB layout and thermal handling.
• Consumer qualification and RoHS compliance: Qualified for consumer applications and RoHS compliant for broad market acceptance.
• Broad operating temperature: Rated from 0°C to 105°C to accommodate a range of consumer embedded environments.

Why Choose MPC8260AZUPJDB-NXP?

The MPC8260AZUPJDB-NXP combines a PowerPC G2 core with dedicated communications co-processors and integrated memory controllers to deliver a focused embedded processing platform for consumer and networking applications. Its 300 MHz operating speed, 3.3 V I/O, and multiple 10/100 Mbps Ethernet interfaces make it a practical choice for designs that require on-chip networking and DRAM/SDRAM support.

Packaged in a 480-TBGA exposed-pad LBGA and built for surface-mount assembly, this RoHS-compliant device from NXP Semiconductors is positioned for designers seeking a compact, integrated solution for consumer-grade embedded systems.

Request a quote or contact sales to discuss availability, pricing, and how the MPC8260AZUPJDB-NXP can fit your next embedded design.