MPC8260AVVPJDB
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 495 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 300MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8260AVVPJDB – PowerPC G2 Microprocessor, 300 MHz, 480‑TBGA
The MPC8260AVVPJDB is a single‑core PowerPC G2 microprocessor in the MPC82xx family designed for embedded communications and networking applications. Running at 300 MHz with a 32‑bit core and integrated communications processing features, it targets high‑integration embedded designs that require a mix of CPU performance and on‑chip peripheral support.
Built for systems that need deterministic embedded processing, the device combines a G2 integer core with communications acceleration and memory controller support to simplify board‑level integration and system design.
Key Features
- Core PowerPC G2 single core, 32‑bit architecture operating at 300 MHz, offering a dual‑issue integer core design and floating‑point unit as specified for the MPC82xx family.
- Cache and MMU Separate 16 KB instruction and 16 KB data caches with a PowerPC‑architecture MMU as described in the MPC826xA hardware specifications.
- Communications Processing Integrated Communication Processor Module (CPM) and RISC CPM co‑processor functions for protocol offload and serial DMA support; suitable for embedded communications tasks.
- Ethernet and Serial Interfaces Support for 10/100 Mbps Ethernet interfaces (up to three) and standard serial buses including I2C, MII and UTOPIA ports as defined for the MPC826x family.
- Memory and DMA On‑chip controllers for DRAM/SDRAM and multiple serial DMAs and virtual IDMAs for efficient data movement between peripherals and system memory.
- Clocking and Power Separate power supplies for internal logic and I/O, and independent PLLs for the G2 core and CPM to allow flexible power/performance configuration.
- Package and Mounting 480‑TBGA package (37.5 × 37.5 mm) with exposed pad; surface‑mount device optimized for high‑density embedded boards.
- Operating Range and Compliance Operating temperature: 0 °C to 105 °C. RoHS compliant.
Typical Applications
- Embedded Networking Equipment Use in routers, switches or access devices where integrated Ethernet interfaces and CPM offload reduce system complexity.
- Telecommunications Systems Suitable for telecom line cards and interface processors that leverage the CPM and serial DMA features for protocol handling.
- Industrial Communications Deployment in industrial gateways and protocol converters that require deterministic embedded processing and SDRAM/DRAM support.
Unique Advantages
- Integrated Communications Engine: On‑chip CPM and RISC CPM co‑processor functions reduce external controller requirements and simplify BOM.
- Balanced CPU and I/O Performance: 300 MHz PowerPC G2 core with dedicated caches and MMU delivers predictable embedded compute performance while supporting multiple high‑speed interfaces.
- Flexible Memory Support: Built‑in DRAM/SDRAM controllers and virtual IDMAs streamline system memory design and high‑throughput data transfers.
- Configurable Clocking: Independent PLLs and clock multipliers for core and CPM enable designers to optimize power vs. performance across subsystems.
- Production‑grade Packaging: 480‑TBGA surface‑mount package with exposed pad supports compact, thermally managed PCB implementations.
Why Choose MPC8260AVVPJDB?
The MPC8260AVVPJDB positions itself as a capable embedded communications processor combining a PowerPC G2 300 MHz core with dedicated communications processing and flexible memory and I/O options. Its integration of CPM functionality, multiple Ethernet interfaces, and on‑chip memory controllers helps reduce system complexity and component count for networking and telecom designs.
This device is well suited to engineers and procurement teams building embedded networking, telecom or industrial communications products that benefit from a single‑chip approach to CPU and peripheral integration, predictable operating temperature range, and RoHS compliance.
Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the MPC8260AVVPJDB.

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