MPC8260AVVPIBB

The MPC8260AVVPIBB is a PowerPC G2 microprocessor IC from NXP Semiconductors' MPC8260 series. It provides a single 32‑bit core operating at 300 MHz and is supplied in a 480‑TBGA package (37.5×37.5 mm), optimized for surface‑mount assembly.

Targeted at embedded communications and networking applications, the device integrates communications‑oriented coprocessor functionality, memory controllers for DRAM/SDRAM, multiple serial interfaces and 10/100 Mbps Ethernet capability to simplify system design and accelerate time to market.

Key Features

• Core and Performance PowerPC G2 single core, 32‑bit architecture running at 300 MHz, suitable for embedded communications processing.
• On‑chip Communications Coprocessor Includes Communications RISC CPM functionality to offload communications tasks and support integrated serial and TDM interfaces as described in product documentation.
• Memory Subsystem Integrated controllers for DRAM and SDRAM to support system memory requirements.
• Ethernet Connectivity 10/100 Mbps Ethernet capability (10/100Mbps (3) as specified) for networked embedded applications.
• Peripheral Interfaces Additional interfaces include I2C and multiple serial peripherals for control, management and peripheral connectivity.
• Power and I/O I/O voltage specified at 3.3 V with separate supplies for internal logic and I/O as defined in the hardware specifications.
• Packaging and Mounting Supplier device package: 480‑TBGA (37.5×37.5); package case listed as 480‑LBGA with exposed pad. Surface mount mounting type for compact system assemblies.
• Operating Range and Compliance Operating temperature range 0 °C to 105 °C and RoHS compliant for environmental regulatory alignment.

Typical Applications

• Embedded Communications Equipment — Use in network controllers, protocol processing and communications endpoints where integrated Ethernet and CPM support reduce system complexity.
• Industrial Control and Automation — Integration of DRAM/SDRAM controllers and serial interfaces makes the device suitable for industrial controllers and protocol gateways.
• Edge and Gateway Devices — 300 MHz PowerPC G2 performance combined with on‑chip communications resources supports edge processing and gateway functions in embedded systems.

Unique Advantages

• Integrated Communications Processing — On‑chip Communications RISC CPM reduces external processor load for protocol and serial handling.
• System‑Level Integration — Built‑in DRAM/SDRAM controllers and multiple serial interfaces simplify board design and lower BOM count.
• Network Connectivity — 10/100 Mbps Ethernet capability enables straightforward network integration for embedded devices.
• Compact Surface‑Mount Package — 480‑TBGA / 480‑LBGA package options provide a dense footprint for space‑constrained systems.
• Industrial Operating Range — 0 °C to 105 °C operating temperature supports a broad set of embedded environments.
• Regulatory Compliance — RoHS compliant for easier regulatory and environmental alignment.

Why Choose MPC8260AVVPIBB?

The MPC8260AVVPIBB positions itself as a compact, communications‑focused PowerPC G2 solution delivering 300 MHz single‑core performance with integrated memory controllers and communications coprocessor resources. Its mix of Ethernet capability, serial interfaces and surface‑mount 480‑TBGA packaging makes it well suited for embedded communications, industrial controllers and edge gateway designs that require a balanced combination of processing and on‑chip peripheral integration.

Backed by the MPC8260 series hardware specifications, including documented core and system features in the product documentation, this device offers a pragmatic option for engineers seeking a RoHS‑compliant, vendor‑supported microprocessor for mid‑range embedded communications applications.

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