MPC8260ACVVMIBB

The MPC8260ACVVMIBB is a PowerPC G2-based embedded microprocessor in the MPC82xx family, delivered in a 480-TBGA (37.5 × 37.5 mm) package. This single-core, 32-bit device runs at 266 MHz and integrates communications-focused peripherals and memory controllers suited to embedded and industrial applications.

Designed for systems that require on-chip communications processing, deterministic compute and extended temperature operation, the part combines a PowerPC G2 core with integrated CPM features, memory interfaces and wide operating-range robustness for industrial deployments.

Key Features

• Core – PowerPC G2, 266 MHz Single 32-bit PowerPC G2 core running at 266 MHz for embedded compute tasks.
• Caches and MMU Family-level documentation specifies separate 16 KB instruction and 16 KB data caches and a PowerPC-compliant MMU for efficient code and data handling.
• Floating-Point and Dual-Issue Integer Family documentation indicates an FPU and a dual-issue integer core implementation for improved compute throughput where floating-point and integer operations are required.
• Communications Processor Module (CPM) and Co-Processors Integrated CPM and communications-oriented co-processors (RISC CPM and communications DSP capabilities) to support serial DMAs, protocol handling and offloaded communications tasks.
• Ethernet Ethernet capability listed as 10/100 Mbps (3) to support networked embedded applications.
• Memory Controllers On-chip support for DRAM and SDRAM controllers to simplify external memory interfacing.
• Interfaces Additional interfaces include I2C; family documentation also details SPI, MII and multiple serial controller options for peripheral connectivity.
• Power and Clocking Separate power domains for core logic and I/O, plus separate PLLs for the G2 core and CPM. Internal clock multipliers provide flexibility in core and bus frequency configuration.
• Package and Mounting 480-LBGA exposed pad / 480-TBGA (37.5 × 37.5 mm) surface-mount package for high I/O density and thermal management.
• Industrial Qualification and Temperature Range Device is listed as Industrial-qualified with an operating temperature range of −40 °C to 105 °C.
• RoHS Compliant Product is RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Embedded Communications Equipment On-chip CPM and Ethernet support make the MPC8260ACVVMIBB suitable for routers, switches and protocol-processing appliances.
• Industrial Control Systems Industrial qualification and −40 °C to 105 °C operation fit motor control, PLCs and factory automation environments.
• Networked Embedded Controllers Integrated memory controllers and serial interfaces support compact networked controllers with real-time processing needs.

Unique Advantages

• Integrated Communications Processing: The embedded CPM and communications co-processor capability reduce external offload requirements and simplify system architecture.
• Deterministic Embedded Performance: PowerPC G2 core at 266 MHz with separate I/D caches and an MMU supports predictable execution for embedded workloads.
• Flexible Clocking and Power Domains: Separate PLLs and power supplies for core and I/O plus internal clock multipliers allow designers to balance performance and power.
• High I/O Density Package: The 480-TBGA package supports extensive I/O and interfaces while providing an exposed pad for thermal dissipation.
• Industrial-Grade Operation: Rated for −40 °C to 105 °C and listed as Industrial-qualified for deployments in harsh environments.
• Reduced BOM and Faster Time-to-Design: On-chip DRAM/SDRAM controllers, serial peripherals and Ethernet support lower component count and simplify board design.

Why Choose MPC8260ACVVMIBB?

The MPC8260ACVVMIBB positions itself as a communications-focused embedded processor that balances compute capability with integrated peripheral support. Its PowerPC G2 core, on-chip CPM features and memory controller integration deliver a compact platform for networked and industrial applications that require robust operation across an extended temperature range.

This part is well suited to engineers designing embedded communications equipment, industrial controllers and networked appliances who need a single-chip solution that reduces external components while providing the interface and thermal/package characteristics required for demanding deployments.

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