MPC8255AZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 1,695 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8255
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8255AZUMHBB – IC MPU MPC82XX 266MHz 480TBGA

The MPC8255AZUMHBB is a PowerPC G2 single-core microprocessor optimized for embedded communications and networking applications. It delivers a 266 MHz 32-bit core with on-chip communications processing and memory controller support, packaged in a 480-TBGA (37.5×37.5 mm) surface-mount package.

Designed for embedded and consumer-grade systems, the device integrates communication peripherals and memory interfaces to simplify system design while offering controlled operating conditions and RoHS compliance.

Key Features

  • Core & Performance PowerPC G2 32-bit single core running at 266 MHz, providing deterministic processing for embedded control and communications tasks.
  • Memory & MMU On-chip support for DRAM and SDRAM controllers and PowerPC architecture–compliant memory management unit for controlled memory handling.
  • Communications & Peripherals Integrated Communications Processor Module (CPM) and co-processor support for communications and RISC CPM functions; additional interfaces include I2C and multiple 10/100 Mbps Ethernet ports (10/100Mbps (3)).
  • Clocking & Power Separate supply domains and PLLs for core and CPM allow flexible clock configuration; I/O voltage is 3.3 V to match common interface standards.
  • Package & Mounting 480-LBGA exposed pad, Supplier Device Package 480-TBGA (37.5×37.5 mm), surface-mount for compact, high-density board designs.
  • Operating Range & Qualification Operating temperature range 0 °C to 105 °C and consumer qualification; RoHS compliant for environmental conformance.

Typical Applications

  • Embedded Networking Equipment Use the integrated CPM and 10/100 Mbps Ethernet capability for routers, switches, and gateway controllers requiring on-chip communications handling.
  • Industrial Embedded Controllers Deploy in control systems that need a compact, surface-mount processor with DRAM/SDRAM support and a 0 °C–105 °C operating range.
  • Communications Endpoints Suitable for devices that require on-chip serial interfaces, I2C, and CPM-managed communications processing.

Unique Advantages

  • Integrated Communications Subsystem: CPM and communications co-processor support reduce external logic and simplify integration for networking-focused designs.
  • Balanced On-Chip Memory Support: DRAM and SDRAM controller support and a PowerPC-compliant MMU enable efficient memory architectures for embedded applications.
  • Flexible Clocking and Power Domains: Separate PLLs and supply domains for core and CPM allow tailored power/performance trade-offs on a per-design basis.
  • Compact, High-Density Package: 480-TBGA (37.5×37.5 mm) surface-mount package with exposed pad facilitates thermal management and space-efficient PCB layouts.
  • Industry-Ready Environmental Compliance: RoHS compliance ensures adherence to common environmental standards for electronic assemblies.

Why Choose MPC8255AZUMHBB?

The MPC8255AZUMHBB positions itself as a focused embedded processor that combines a 266 MHz PowerPC G2 core with integrated communications processing and memory interface support. Its feature set is well matched to designs requiring on-chip CPM functionality, Ethernet connectivity, and standard 3.3 V I/O signaling.

This part is appropriate for engineers designing compact, surface-mount embedded systems in networking and industrial segments who need a single-chip solution with clear operating parameters, a robust package footprint, and RoHS compliance.

Request a quote or submit a pricing and availability inquiry to obtain lead-time and volume pricing for the MPC8255AZUMHBB.

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