MPC8260ACVVMHBB

The MPC8260ACVVMHBB is a PowerPC G2 single-core microprocessor operating at 266 MHz, designed for embedded communications and industrial applications. It combines a 32-bit core with integrated communications co-processors and memory controllers to support networking, control, and protocol-processing use cases.

Targeted for embedded and industrial systems, this device offers integrated 10/100 Mbps Ethernet ports, DRAM/SDRAM controllers, and a 480‑TBGA package with an exposed pad for thermal management, delivering a compact, industry‑qualified processing solution.

Key Features

• Core: PowerPC G2 single 32‑bit core running at 266 MHz, suitable for deterministic embedded workloads.
• On‑chip Processors and Co‑processors: Communications and RISC CPM co‑processors for offloading protocol and communications tasks.
• Memory Support: Integrated DRAM and SDRAM controllers to simplify external memory interfacing and system design.
• Ethernet Connectivity: Three 10/100 Mbps Ethernet interfaces for multi‑port networking and gateway applications.
• I/O and Interfaces: 3.3 V I/O voltage with additional interfaces including I2C; surface‑mount 480‑TBGA package (37.5 × 37.5 mm) for dense board layouts.
• Package and Thermal: 480‑LBGA with exposed pad provides a robust thermal interface and board‑level mounting suitable for industrial environments.
• Qualification and Temperature Range: Industrial qualification with an operating temperature range of −40 °C to 105 °C for harsh environments.
• System Integration Features: Series documentation describes PowerQUICC II‑class capabilities such as MMU, caches, and CPM/PLL separation for flexible clocking and power/performance optimization.

Typical Applications

• Industrial Networking: Multi‑port 10/100 Mbps Ethernet and on‑chip communications processing make it suitable for industrial switches, protocol converters, and remote I/O controllers.
• Embedded Communications Equipment: Designed for routers, gateways, and protocol offload devices that require integrated CPM resources and deterministic processing.
• Edge and Control Systems: DRAM/SDRAM support and industrial temperature operation enable deployment in edge controllers and automation equipment.
• Telecommunications Infrastructure: Use in telecom appliances where integrated communications co‑processors and multiple Ethernet interfaces reduce external component count.

Unique Advantages

• Integrated Communications Capability: Built‑in communications co‑processors and multiple 10/100 Mbps Ethernet ports reduce the need for external protocol engines and PHYs.
• Industrial‑Grade Operation: −40 °C to 105 °C operating range and industrial qualification support deployment in temperature‑sensitive environments.
• Simplified Memory Interface: On‑chip DRAM and SDRAM controllers streamline memory subsystem design and speed time to market.
• Compact Thermal‑Aware Packaging: 480‑TBGA with exposed pad enables compact board layouts while addressing thermal dissipation requirements.
• Vendor Documentation and Series Heritage: Part of the MPC82xx PowerQUICC II family with detailed hardware specifications available for system integration and design validation.

Why Choose MPC8260ACVVMHBB?

The MPC8260ACVVMHBB positions itself as a reliable, industrially qualified embedded processor for communications‑centric applications. With a PowerPC G2 core at 266 MHz, integrated communications co‑processors, multi‑port Ethernet, and on‑chip memory controllers, it provides a compact, highly integrated foundation for networking, industrial automation, and edge control designs.

Engineers and procurement teams seeking a documented, industrial‑temperature microprocessor from NXP Semiconductors will find this device suitable for designs that require deterministic processing, tight integration of communications features, and a board‑level package designed for thermal management and surface‑mount assembly.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the MPC8260ACVVMHBB today.