MPC8260AVVMHBB

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 353 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8260AVVMHBB – PowerPC G2 Microprocessor, 266 MHz, 480-TBGA

The MPC8260AVVMHBB is a PowerPC G2-based microprocessor in the MPC82xx family designed for embedded communications and control applications. This single-core, 32-bit MPU runs at 266 MHz and is packaged in a 480-TBGA (37.5×37.5 mm) surface-mount package with an exposed pad for thermal management.

Targeted at consumer-qualified embedded designs, the device combines a high-performance PowerPC core with integrated communications support and memory interfaces to simplify system design while meeting industry-standard I/O voltage and thermal requirements.

Key Features

  • Core and Performance PowerPC G2 single-core, 32-bit architecture running at 266 MHz as specified for the MPC8260 family.
  • Memory and Controllers On-chip support for DRAM and SDRAM controllers to interface with external system memory.
  • Communications Co-processor (CPM) Communications-oriented coprocessor and DSP capabilities are indicated in the product specifications to support protocol handling and serial offload.
  • Ethernet Connectivity 10/100 Mbps Ethernet capability (specification lists “10/100Mbps (3)”) for embedded networked applications.
  • System Interfaces Additional interfaces include I2C and a range of serial/peripheral blocks documented for the MPC826x series.
  • Power and Voltage I/O operates at 3.3 V with separate supply domains noted in the family-level documentation for core and I/O.
  • Package and Mounting 480-TBGA (37.5×37.5 mm) supplier device package and 480-LBGA exposed-pad package case; surface-mount mounting type optimized for high pin-count designs and thermal dissipation.
  • Operating Temperature and Qualification Rated for 0 °C to 105 °C operating temperature and listed as Consumer-qualified.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • Embedded Networking and Communications — Leverages the PowerPC G2 core and communications coprocessor support for protocol processing and 10/100 Mbps Ethernet connectivity.
  • Industrial and Embedded Control — 266 MHz processing with DRAM/SDRAM controller support and industrial-temperature-capable operation for embedded controllers.
  • Appliance and Consumer Electronics — Consumer-qualified MPU suitable for embedded control and connectivity tasks in consumer devices.

Unique Advantages

  • Integrated Communications Support: Communications DSP and RISC CPM functionality reduce external offload requirements and simplify protocol handling.
  • Clear Memory Interface Options: Built-in DRAM and SDRAM controller support streamlines memory subsystem design.
  • High-Density Package: 480-TBGA / 480-LBGA exposed-pad packaging provides the pin count and thermal path required for complex embedded systems.
  • Consumer Qualification and RoHS Compliance: Qualification status and RoHS compliance help meet regulatory and market requirements for consumer products.
  • Defined Operating Range and I/O Voltage: 3.3 V I/O and 0 °C to 105 °C operating range provide tangible design constraints for thermal and power planning.

Why Choose MPC8260AVVMHBB?

The MPC8260AVVMHBB delivers a compact, integration-focused solution for embedded designs that require a 266 MHz PowerPC G2 core combined with communications-focused peripherals and memory interfaces. Its 480-TBGA / exposed-pad package and specified temperature range make it suitable for consumer-grade networking and control systems where board-level density and thermal considerations are important.

Designed from the MPC826x family specifications, this device is appropriate for engineers building embedded platforms that need balanced on-chip communications capability, standard 3.3 V I/O, and a high-pin-count BGA package with RoHS compliance for long-term supply and regulatory alignment.

Request a quote for the MPC8260AVVMHBB or submit a request for pricing and availability to evaluate this PowerPC G2 microprocessor for your next embedded design.

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