MPC8260AVVMHBB
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 353 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of MPC8260AVVMHBB – PowerPC G2 Microprocessor, 266 MHz, 480-TBGA
The MPC8260AVVMHBB is a PowerPC G2-based microprocessor in the MPC82xx family designed for embedded communications and control applications. This single-core, 32-bit MPU runs at 266 MHz and is packaged in a 480-TBGA (37.5×37.5 mm) surface-mount package with an exposed pad for thermal management.
Targeted at consumer-qualified embedded designs, the device combines a high-performance PowerPC core with integrated communications support and memory interfaces to simplify system design while meeting industry-standard I/O voltage and thermal requirements.
Key Features
- Core and Performance PowerPC G2 single-core, 32-bit architecture running at 266 MHz as specified for the MPC8260 family.
- Memory and Controllers On-chip support for DRAM and SDRAM controllers to interface with external system memory.
- Communications Co-processor (CPM) Communications-oriented coprocessor and DSP capabilities are indicated in the product specifications to support protocol handling and serial offload.
- Ethernet Connectivity 10/100 Mbps Ethernet capability (specification lists “10/100Mbps (3)”) for embedded networked applications.
- System Interfaces Additional interfaces include I2C and a range of serial/peripheral blocks documented for the MPC826x series.
- Power and Voltage I/O operates at 3.3 V with separate supply domains noted in the family-level documentation for core and I/O.
- Package and Mounting 480-TBGA (37.5×37.5 mm) supplier device package and 480-LBGA exposed-pad package case; surface-mount mounting type optimized for high pin-count designs and thermal dissipation.
- Operating Temperature and Qualification Rated for 0 °C to 105 °C operating temperature and listed as Consumer-qualified.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Embedded Networking and Communications — Leverages the PowerPC G2 core and communications coprocessor support for protocol processing and 10/100 Mbps Ethernet connectivity.
- Industrial and Embedded Control — 266 MHz processing with DRAM/SDRAM controller support and industrial-temperature-capable operation for embedded controllers.
- Appliance and Consumer Electronics — Consumer-qualified MPU suitable for embedded control and connectivity tasks in consumer devices.
Unique Advantages
- Integrated Communications Support: Communications DSP and RISC CPM functionality reduce external offload requirements and simplify protocol handling.
- Clear Memory Interface Options: Built-in DRAM and SDRAM controller support streamlines memory subsystem design.
- High-Density Package: 480-TBGA / 480-LBGA exposed-pad packaging provides the pin count and thermal path required for complex embedded systems.
- Consumer Qualification and RoHS Compliance: Qualification status and RoHS compliance help meet regulatory and market requirements for consumer products.
- Defined Operating Range and I/O Voltage: 3.3 V I/O and 0 °C to 105 °C operating range provide tangible design constraints for thermal and power planning.
Why Choose MPC8260AVVMHBB?
The MPC8260AVVMHBB delivers a compact, integration-focused solution for embedded designs that require a 266 MHz PowerPC G2 core combined with communications-focused peripherals and memory interfaces. Its 480-TBGA / exposed-pad package and specified temperature range make it suitable for consumer-grade networking and control systems where board-level density and thermal considerations are important.
Designed from the MPC826x family specifications, this device is appropriate for engineers building embedded platforms that need balanced on-chip communications capability, standard 3.3 V I/O, and a high-pin-count BGA package with RoHS compliance for long-term supply and regulatory alignment.
Request a quote for the MPC8260AVVMHBB or submit a request for pricing and availability to evaluate this PowerPC G2 microprocessor for your next embedded design.

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