MPC8260AZUPJDB

IC MPU MPC82XX 300MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5)

Quantity 176 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed300MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of MPC8260AZUPJDB – PowerPC G2 300 MHz 32‑Bit Microprocessor

The MPC8260AZUPJDB is a single‑core PowerPC G2 microprocessor IC operating at 300 MHz, designed for embedded applications that require integrated communications and system‑level functionality. It combines a 32‑bit core, on‑chip communications processing, memory controllers and multiple serial interfaces to support embedded communications, industrial control, and networked appliance designs.

Key value propositions include a high‑performance PowerPC G2 core with separate caches, integrated communications co‑processors (CPM), flexible clocking and power domains, and a compact 480‑TBGA surface‑mount package for board‑level integration.

Key Features

  • Core PowerPC G2 single‑core 32‑bit processor running at 300 MHz with an integrated floating‑point unit and separate 16 KB instruction and 16 KB data caches.
  • Communications Co‑processors On‑chip communications and RISC CPM co‑processors to offload protocol and data‑plane tasks for embedded networking applications.
  • Memory Support Integrated DRAM and SDRAM controllers for system memory interfacing and a 64‑bit data / 32‑bit address 60x bus architecture (as described in the device family datasheet).
  • Ethernet and Serial Interfaces 10/100 Mbps Ethernet connectivity and additional serial interfaces including I2C to support peripheral communication and networked I/O.
  • Power and Clock Flexibility Separate power supplies for internal logic and I/O and independent PLLs for the G2 core and CPM, enabling power/performance optimization and flexible clock multipliers.
  • Package and Mounting 480‑TBGA package (37.5 × 37.5 mm) with 480‑lead L‑BGA exposed pad, surface‑mount mounting type suitable for compact board designs.
  • Operating Range and Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C and RoHS compliance.

Typical Applications

  • Embedded Networking Used in networked appliances and communication endpoints where integrated Ethernet and CPM capabilities simplify protocol handling and data throughput.
  • Industrial Control Suitable for embedded controllers that require deterministic processing at 300 MHz along with DRAM/SDRAM support and robust I/O interfacing.
  • Communications Equipment Fits applications that benefit from on‑chip communications co‑processors and multiple serial interfaces for protocol offload and peripheral connectivity.

Unique Advantages

  • Integrated Communications Processing: On‑chip CPM and communications co‑processors reduce external logic and simplify protocol implementation.
  • Balanced Performance and Efficiency: 300 MHz PowerPC G2 core with separate instruction and data caches delivers predictable processing for embedded workloads.
  • Flexible System Design: Separate PLLs for core and CPM plus multiple clock multiplier options enable tuning of performance versus power consumption.
  • Memory and I/O Integration: Built‑in DRAM/SDRAM controllers and serial interfaces including I2C streamline system memory and peripheral connectivity.
  • Robust Packaging: 480‑TBGA surface‑mount package with exposed pad supports high‑density board layouts and thermal considerations.
  • Regulatory and Environmental Compliance: RoHS‑compliant construction aligns with modern environmental requirements.

Why Choose MPC8260AZUPJDB?

The MPC8260AZUPJDB positions itself as a compact, integrated solution for embedded designs that require a PowerPC G2 processing core combined with dedicated communications functionality. With a 300 MHz core, integrated memory controllers, CPM co‑processors and Ethernet support, it simplifies board‑level architecture for networking and industrial applications while enabling flexible clock and power management.

This device is suited to engineers and procurement teams seeking a single‑chip approach to embedded communications and control where performance, integration and predictable thermal/operating characteristics (0 °C to 105 °C) are important. Backed by NXP Semiconductors product documentation, it supports designs that prioritize long‑term availability and established supplier support.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead‑time information for the MPC8260AZUPJDB.

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