 | | MPC8270VRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,244 | |
 | | MPC8270VVQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 143 | |
 | | MPC8270VVUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,079 | |
 | | MPC8270ZQMIBA | NXP Semiconductors | IC MPU MPC82XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,923 | |
 | | MPC8270ZUQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 437 | |
 | | MPC8270ZUUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 833 | |
 | | MPC8271CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 576 | |
 | | MPC8271CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,453 | |
 | | MPC8271CZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 98 | |
 | | MPC8271VRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ 516FPBGA | Microprocessors | 516-FPBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-FPBGA (27×27) | 116 | |
 | | MPC8271VRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 100 | |
 | | MPC8271ZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,680 | |
 | | MPC8271ZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 261 | |
 | | MPC8272CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,435 | |
 | | MPC8272CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,911 | |
 | | MPC8272CZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 180 | |
 | | MPC8272CZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 641 | |
 | | MPC8272VRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 509 | |
 | | MPC8272VRPIEA | NXP Semiconductors | IC MPU MPC82XX 300MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 202 | |
 | | MPC8272VRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 660 | |