 | | MPC8260AVVMHBB | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,626 | |
 | | MPC8260AVVPIBB | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 843 | |
 | | MPC8260AVVPJDB | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 87 | |
 | | MPC8260AZUMHBB | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,401 | |
 | | MPC8260AZUPJDB | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,096 | |
 | | MPC8260AZUPJDB-NXP | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,241 | |
 | | MPC8264ACZUMIBB | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,778 | |
 | | MPC8264AZUPIBB | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,676 | |
 | | MPC8265ACVVMIBC | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,545 | |
 | | MPC8265ACZUMHBC | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,332 | |
 | | MPC8265ACZUMIBC | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,753 | |
 | | MPC8265AVVPIBC | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 587 | |
 | | MPC8265AVVPJDC | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 459 | |
 | | MPC8265AZUPJDC | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 704 | |
 | | MPC8270CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,391 | |
 | | MPC8270CVVQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,035 | |
 | | MPC8270CVVUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,249 | |
 | | MPC8270CZQMIBA | NXP Semiconductors | IC MPU MPC82XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 748 | |
 | | MPC8270CZUQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,310 | |
 | | MPC8270CZUUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,004 | |