 | | MPC8272VRTMFA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,923 | |
 | | MPC8272ZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,294 | |
 | | MPC8272ZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,350 | |
 | | MPC8275CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,923 | |
 | | MPC8275CZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 295 | |
 | | MPC8275VRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,422 | |
 | | MPC8275ZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 198 | |
 | | MPC8280CVVQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 991 | |
 | | MPC8280CVVUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 420 | |
 | | MPC8280CZUQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 133 | |
 | | MPC8280CZUUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 530 | |
 | | MPC8280VVQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,077 | |
 | | MPC8280VVUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 778 | |
 | | MPC8280ZUQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 431 | |
 | | MPC8280ZUUPEA | NXP Semiconductors | IC MPU MPC82XX 450MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 183 | |
 | | MPC8306CVMABDCA | NXP Semiconductors | IC MPU MPC83XX 133MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 472 | |
 | | MPC8306CVMACDCA | NXP Semiconductors | IC MPU MPC83XX 200MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 72 | |
 | | MPC8306CVMADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,040 | |
 | | MPC8306CVMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 369-PBGA (19×19) | 427 | |
 | | MPC8306SCVMABDCA | NXP Semiconductors | IC MPU MPC83XX 133MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,507 | |