Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8308VMAFDAMPC8308VMAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 473MAPBGAMicroprocessors473-MAPBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
473-LFBGA
Supplier Device Package:
473-MAPBGA (19×19)
422
MPC8308VMAGDMPC8308VMAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 473MAPBGAMicroprocessors473-MAPBGA (19x19)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
639
MPC8308VMAGDAMPC8308VMAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 473MAPBGAMicroprocessors473-MAPBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
473-LFBGA
Supplier Device Package:
473-MAPBGA (19×19)
1,289
MPC8309CVMADDCAMPC8309CVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
1,087
MPC8309CVMAFDCAMPC8309CVMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 489BGAMicroprocessors489-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,553
MPC8309CVMAGDCAMPC8309CVMAGDCANXP SemiconductorsIC MPU MPC83XX 400MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
378
MPC8309CVMAHFCAMPC8309CVMAHFCANXP SemiconductorsIC MPU MPC83XX 417MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
417MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
541
MPC8309VMADDCAMPC8309VMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 489BGAMicroprocessors489-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
271
MPC8309VMAFDCAMPC8309VMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
264
MPC8309VMAGDCAMPC8309VMAGDCANXP SemiconductorsPOWERQUICC POWER ARCH SOC, 400MHMicroprocessors489-PBGA (19x19)N/A0 °C – 105 °C
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR2
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Communications; QUICC Engine
Qualification:
Consumer
835
MPC8309VMAHFCAMPC8309VMAHFCANXP SemiconductorsIC MPU MPC83XX 417MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
417MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
1,158
MPC8313CVRADDBMPC8313CVRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
733
MPC8313CVRADDCMPC8313CVRADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
400
MPC8313CVRAFFMPC8313CVRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
445
MPC8313CVRAFFBMPC8313CVRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,473
MPC8313CVRAFFCMPC8313CVRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
153
MPC8313CVRAGDCMPC8313CVRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 2.2
Qualification:
Industrial
1,818
MPC8313CZQADDCMPC8313CZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
1
MPC8313CZQAFFCMPC8313CZQAFFCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 2.2
Qualification:
Industrial
664
MPC8313CZQAGDCMPC8313CZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
1,241

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