 | | MPC8308VMAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 422 | |
 | | MPC8308VMAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 639 | |
 | | MPC8308VMAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 1,289 | |
 | | MPC8309CVMADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 489-PBGA (19×19) | 1,087 | |
 | | MPC8309CVMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,553 | |
 | | MPC8309CVMAGDCA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 489-PBGA (19×19) | 378 | |
 | | MPC8309CVMAHFCA | NXP Semiconductors | IC MPU MPC83XX 417MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 489-PBGA (19×19) | 541 | |
 | | MPC8309VMADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | 1.8V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 271 | |
 | | MPC8309VMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 489-PBGA (19×19) | 264 | |
 | | MPC8309VMAGDCA | NXP Semiconductors | POWERQUICC POWER ARCH SOC, 400MH | Microprocessors | 489-PBGA (19x19) | N/A | 0 °C – 105 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine | 835 | |
 | | MPC8309VMAHFCA | NXP Semiconductors | IC MPU MPC83XX 417MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 489-PBGA (19×19) | 1,158 | |
 | | MPC8313CVRADDB | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 733 | |
 | | MPC8313CVRADDC | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 400 | |
 | | MPC8313CVRAFF | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 445 | |
 | | MPC8313CVRAFFB | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,473 | |
 | | MPC8313CVRAFFC | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 153 | |
 | | MPC8313CVRAGDC | NXP Semiconductors | IC MPU POWERQUICC II PRO 516PBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | N/A | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 2.2 | 1,818 | |
 | | MPC8313CZQADDC | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1 | |
 | | MPC8313CZQAFFC | NXP Semiconductors | IC MPU POWERQUICC II PRO 516PBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | N/A | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 2.2 | 664 | |
 | | MPC8313CZQAGDC | NXP Semiconductors | IC MPU MPC83XX 400MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1,241 | |