MPC8313CVRAGDC

IC MPU POWERQUICC II PRO 516PBGA
Part Description

Microprocessor IC * 516-TEPBGA (27x27)

Quantity 676 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitPackage / Case516-BBGA Exposed PadQualificationIndustrial
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
USBUSB 2.0 + PHY (1)

Overview of MPC8313CVRAGDC – IC MPU POWERQUICC II PRO 516PBGA

The MPC8313CVRAGDC is a PowerQUICC II Pro microprocessor integrating a single PowerPC e300c3 core. It combines a 32‑bit CPU architecture with on‑chip system interfaces and memory controllers to address embedded networking, printing/imaging, consumer and industrial I/O processing needs.

Designed as a cost‑effective, low‑power, highly integrated host processor, the device targets applications that benefit from integrated Ethernet, DDR/DDR2 memory support, on‑chip security acceleration and a compact 516‑BBGA exposed‑pad package.

Key Features

  • Core  PowerPC e300c3 core with a single 32‑bit processing engine; includes 16 KB of L1 instruction and 16 KB of L1 data cache and on‑chip memory management units (MMUs).
  • Security Co‑processor  Integrated security co‑processor (SEC 2.2) providing hardware cryptography acceleration for embedded security functions.
  • Memory  On‑chip controllers for DDR and DDR2 SDRAM, enabling common high‑speed external memory configurations for embedded systems.
  • Ethernet  Dual enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps (2 ports) for wired networking and I/O offload.
  • USB  USB 2.0 controller with integrated PHY (1) for host/device connectivity and peripheral interfacing.
  • Peripheral Interfaces  Documented peripheral blocks include DUART, HSSI, Enhanced Local Bus, JTAG, I²C, PCI, timers, GPIO and SPI as shown in the processor documentation.
  • Package & Mounting  516‑TEPBGA (27 × 27 mm) supplier device package, 516‑BBGA with exposed pad, designed for surface‑mount assembly.
  • Qualification  Industrial qualification and RoHS compliance for regulated environmental requirements.

Typical Applications

  • Networking Equipment  Ideal for switches, VPN routers, network access servers and intelligent NIC designs where dual Gigabit Ethernet and integrated peripherals simplify board-level design.
  • Printing & Imaging  Suitable as a main CPU or I/O processor in printing systems and imaging devices that require integrated memory controllers and I/O subsystems.
  • Wireless Infrastructure  Applicable to WLAN and wireless access designs that need a compact, integrated processor with Ethernet and USB connectivity.
  • Industrial Controllers  Fits industrial control applications requiring a single 32‑bit core, robust I/O connectivity and industrial qualification.

Unique Advantages

  • Highly integrated architecture: Single e300c3 core plus on‑chip MMUs and L1 caches reduce external component count and simplify system design.
  • On‑board security acceleration: SEC 2.2 co‑processor enables hardware cryptography to offload security tasks from the main CPU.
  • Dual Gigabit Ethernet: Two 10/100/1000 Mbps Ethernet controllers provide native multi‑port networking without additional PHYs.
  • Flexible memory support: DDR and DDR2 memory controllers support common embedded memory topologies for performance and capacity scaling.
  • Compact BGA package: 516‑BBGA exposed‑pad package (516‑TEPBGA, 27×27 mm) offers a space‑efficient footprint for dense board layouts.
  • Industrial readiness: Industrial qualification and RoHS compliance support deployment in regulated embedded applications.

Why Choose MPC8313CVRAGDC?

The MPC8313CVRAGDC positions itself as a compact, integrated processor platform that balances CPU capability, security acceleration, and multi‑port networking in a single package. Its PowerPC e300c3 core with L1 caching and MMUs, combined with DDR/DDR2 memory interfaces and dual Gigabit Ethernet, makes it suitable for embedded designs that require reliable connectivity and on‑chip peripherals.

This device is well suited to engineers and product teams building networking, imaging, wireless and industrial control systems who need a cost‑effective, low‑power processor with integrated security and multiple high‑speed interfaces. The combination of industrial qualification and an exposed‑pad BGA package supports scalable, long‑lifecycle deployments and streamlined BOMs.

Request a quote or contact sales to discuss availability, pricing and how MPC8313CVRAGDC can fit your next embedded design.

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