MPC8313CZQADDC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 520 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 516-BBGA Exposed Pad | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | ||
| Speed | 267MHz | Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313CZQADDC – PowerPC e300c3 1‑Core 267 MHz Microprocessor
The MPC8313CZQADDC is a PowerQUICC II Pro class microprocessor integrating a single PowerPC e300c3 core running at 267 MHz. It targets embedded networking, industrial and imaging designs that require a compact, cost‑effective and low‑power host processor.
Built for system-level integration, the device combines on‑chip cache and MMU support with high‑speed interfaces and security features to address applications such as networking switches, NAS/VPN routers, industrial controllers and printing systems.
Key Features
- Core – PowerPC e300c3 single core, 32‑bit architecture with on‑chip MMUs and 16 KB L1 instruction and 16 KB L1 data caches as described in the device documentation.
- Performance – 267 MHz operating frequency for control and I/O processing tasks.
- Memory – Integrated controllers for DDR and DDR2 SDRAM to support system memory requirements.
- Ethernet – Two enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps operation for wired networking applications.
- USB and Serial – USB 2.0 with PHY (1) plus DUART for serial connectivity and peripheral interfacing.
- Security – On‑chip security subsystem (SEC 2.2) providing cryptography capabilities.
- Package and Mounting – 516‑TEPBGA (27×27) package with exposed pad; surface mount assembly.
- Industrial Qualification – Specified for industrial operation with an operating temperature range of –40 °C to 105 °C.
- Standards and Compliance – RoHS compliant.
Typical Applications
- Networking Infrastructure – Used in switches, line cards and intelligent NICs where dual 10/100/1000 Mbps Ethernet and on‑chip processing accelerate packet handling and control tasks.
- Storage & Security Appliances – Suitable for NAS and VPN router designs that require integrated Ethernet, USB 2.0 and cryptography functions.
- Industrial Controllers – Deployed in industrial control systems that demand industrial temperature operation and robust peripheral connectivity.
- Printing and Imaging – Serves as a main CPU or I/O processor in printing systems and imaging equipment, leveraging integrated memory controllers and serial interfaces.
Unique Advantages
- Highly integrated, low‑power platform: Described as cost‑effective and low‑power in the product literature, reducing board complexity for embedded designs.
- On‑chip cache and MMU: e300c3 core includes L1 instruction and data caches and memory management units to support predictable software performance and system memory protection.
- Dual gigabit Ethernet: Two enhanced three‑speed Ethernet controllers provide hardware support for high‑throughput networking applications.
- Flexible memory support: DDR and DDR2 SDRAM controllers enable designers to choose memory technologies that match system performance and cost targets.
- Industrial temperature range: Specified for –40 °C to 105 °C operation, supporting deployment in harsh or temperature‑sensitive environments.
- Integrated security engine: SEC 2.2 cryptography capabilities help implement secure communications and storage functions on‑chip.
Why Choose MPC8313CZQADDC?
The MPC8313CZQADDC positions itself as an integrated, industrial‑grade embedded processor balancing performance, interface density and on‑chip security. With a PowerPC e300c3 core, dual gigabit Ethernet controllers, DDR/DDR2 memory support and industrial temperature qualification, it is well suited for networked and control‑centric designs that need a compact, surface‑mount solution.
Backed by NXP Semiconductors and documented as part of the PowerQUICC II Pro family, the device offers a clear upgrade path within the same processor family and provides long‑term value for products requiring established silicon and documented hardware features.
Request a quote or contact sales to discuss availability, pricing and how the MPC8313CZQADDC can be integrated into your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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