MPC8313ECVRADDC

The MPC8313ECVRADDC is a single‑core PowerPC e300c3 microprocessor operating at 267 MHz, supplied in a 516‑TEPBGA (27×27) surface‑mount package. It is a cost‑effective, low‑power, highly integrated host processor designed for embedded applications across printing and imaging, networking, consumer, and industrial markets.

Built on the MPC8313E PowerQUICC II Pro architecture, the device integrates Ethernet, memory controllers, security acceleration and common peripheral interfaces to simplify system design and accelerate time‑to‑market.

Key Features

• Core and Performance  PowerPC e300c3 32‑bit core running at 267 MHz with on‑chip memory management and 16 KB L1 instruction and 16 KB L1 data caches (as documented in the MPC8313E series).
• Memory Support  Integrated controllers for DDR and DDR2 SDRAM to support system memory requirements and external DRAM interfacing.
• Networking Interfaces  Dual enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps (2) for robust wired networking connectivity.
• USB and Serial  USB 2.0 host/device support with integrated PHY (1) plus additional serial interfaces such as DUART for console and peripheral communication.
• Security Acceleration  On‑chip security engine (SEC 2.2) for cryptographic functions and secure data handling.
• Package and Mounting  516‑BBGA exposed pad package (516‑TEPBGA, 27×27) designed for surface‑mount assembly.
• Industrial Qualification & Temperature Range  Qualified for industrial applications with operating temperature range from −40°C to 105°C.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Networking Equipment  Ideal for switches, line cards, NAS and VPN routers that require dual gigabit Ethernet ports and integrated memory interfaces.
• Industrial Controllers  Suited for embedded industrial control systems that demand industrial‑grade temperature support and integrated security features.
• Printing and Imaging Systems  Used as a main CPU or I/O processor in printers and imaging devices where cost‑effective processing and peripheral integration reduce system complexity.
• Wireless and Access Devices  Applicable to WLAN and intelligent NIC designs that leverage integrated interfaces, USB and serial connectivity.

Unique Advantages

• Highly integrated processor  Combines CPU, memory controllers, Ethernet and peripheral interfaces to reduce BOM and simplify board design.
• On‑chip security acceleration  SEC 2.2 cryptographic engine offloads security tasks from the CPU, improving system throughput for secure communications.
• Dual gigabit Ethernet  Two 10/100/1000 Mbps controllers enable demanding networking topologies and dual‑port connectivity without external MACs.
• Industrial temperature qualification  −40°C to 105°C operating range supports deployment in demanding environmental conditions.
• Compact BGA package  516‑TEPBGA (27×27) with exposed pad provides a high‑pin‑count footprint for complex I/O in a compact form factor.
• Documented family and ecosystem  Based on the MPC8313E PowerQUICC II Pro family with published datasheet and hardware specifications to support development and validation.

Why Choose MPC8313ECVRADDC?

The MPC8313ECVRADDC delivers a balanced combination of embedded processing, integrated networking, memory interfacing and security acceleration within a single, industrial‑qualified PowerPC e300c3 package. Its integration reduces external component count and simplifies system design for networking, printing and industrial control applications.

This device is well suited to engineers and system designers seeking a documented PowerQUICC II Pro‑based solution that supports DDR/DDR2 memory, dual gigabit Ethernet, USB 2.0 with PHY, and on‑chip security—enabling compact, robust platforms backed by the MPC8313E series documentation.

Request a quote or submit a pricing inquiry to evaluate MPC8313ECVRADDC for your next embedded design project.