MPC8313ECVRAFFC

IC MPU MPC83XX 333MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27)

Quantity 1,678 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN5A002A1 NXPEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGA Exposed PadRAM ControllersDDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptographySpeed333MHz
Supplier Device Package516-TEPBGA (27×27)USBUSB 2.0 + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8313ECVRAFFC – IC MPU MPC83XX 333MHZ 516TEPBGA

The MPC8313ECVRAFFC is a PowerPC e300c3 microprocessor IC delivering a single 32‑bit core at 333 MHz in a 516‑TEPBGA (27×27) exposed‑pad package. It combines processor performance with on‑chip peripherals and controllers for compact, integrated embedded designs.

Designed for cost‑sensitive and industrial applications, the device supports integrated Ethernet, DDR/DDR2 memory controllers, USB 2.0 with PHY and security acceleration, making it suitable for networking, industrial control and imaging/printing systems that require reliable, long‑life operation.

Key Features

  • Core – PowerPC e300c3 single 32‑bit core at 333 MHz with on‑chip MMU and 16 KB instruction and 16 KB data L1 caches as described in the product documentation.
  • Memory support – Integrated DDR and DDR2 SDRAM memory controller for flexible system memory configurations.
  • Networking – Dual three‑speed Ethernet controllers supporting 10/100/1000 Mbps (2 ports) for high‑throughput wired connectivity.
  • USB – USB 2.0 controller with integrated PHY (1) to support peripheral and host connectivity.
  • Security & cryptography – On‑chip security features and SEC 2.2 support provide cryptographic acceleration for secure communications and data handling.
  • Peripherals & interfaces – DUART and a range of on‑chip peripheral controllers to simplify I/O and system integration.
  • Package & mounting – 516‑BBGA exposed pad, supplied in 516‑TEPBGA (27×27) package; surface‑mount device for automated assembly.
  • Industrial qualification & temperature range – Qualified for industrial use with an operating temperature range of −40 °C to 105 °C.
  • Environmental compliance – RoHS compliant for meeting common environmental requirements.
  • Integration & efficiency – Documented as a cost‑effective, low‑power, highly integrated host processor in the product literature to help reduce board space and BOM cost.
  • Graphics – No graphics acceleration; optimized for control, networking and I/O processing tasks rather than display graphics.

Typical Applications

  • Printing and imaging systems – Acts as a main CPU or I/O processor for print engines and imaging controllers, leveraging integrated memory and I/O controllers.
  • Networking equipment – Suitable for switches, line cards and intelligent NICs that require dual 10/100/1000 Mbps Ethernet ports and secure data handling.
  • Network access devices – Fits NAS, VPN routers and wireless LAN infrastructure where USB 2.0, Ethernet and cryptographic acceleration are required.
  • Industrial controllers – Industrial control and automation applications benefit from the industrial temperature range, surface‑mount package and on‑chip interfaces for reliable operation in harsh environments.
  • Consumer and embedded systems – Embedded consumer devices that need a compact, integrated processor with peripheral support and low power characteristics.

Unique Advantages

  • Highly integrated solution: Dual Ethernet, DDR/DDR2 controllers, USB 2.0 PHY and peripheral interfaces reduce external components and simplify board design.
  • Industrial‑grade operation: −40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
  • Security acceleration: On‑chip SEC 2.2 and cryptography features help offload secure processing tasks and streamline secure communications.
  • Compact, manufacturable package: 516‑TEPBGA (27×27) exposed‑pad BGA in a surface‑mount form factor supports automated assembly and efficient thermal management.
  • Cost and power optimized: Documented as a cost‑effective, low‑power processor option to help balance system performance with BOM and operating costs.
  • Proven architecture: PowerPC e300c3 core with L1 caches and MMU as detailed in the product documentation for predictable software integration and porting.

Why Choose MPC8313ECVRAFFC?

The MPC8313ECVRAFFC positions itself as a balanced embedded MPU that combines a PowerPC e300c3 core with integrated memory controllers, dual gigabit Ethernet and on‑chip security—delivering system‑level integration for networking, industrial and imaging platforms. Its industrial qualification and extended temperature range make it suitable for designs that require robust, long‑lifecycle components.

Backed by NXP Semiconductors product documentation and ecosystem resources, the MPC8313ECVRAFFC is appropriate for teams seeking a compact, integrated processor that reduces BOM complexity while providing the peripheral set and security features needed for connected embedded applications.

Request a quote or submit an inquiry to receive pricing, lead‑time and availability details for the MPC8313ECVRAFFC.

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