MPC8313ECZQAGDC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 1,078 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 NXP | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA Exposed Pad | RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 400MHz | ||
| Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313ECZQAGDC – IC MPU MPC83XX 400MHZ 516TEPBGA
The MPC8313ECZQAGDC is a single‑core, 32‑bit PowerPC e300c3 microprocessor from NXP Semiconductors, operating at 400 MHz and packaged in a 516‑TEPBGA (27×27) surface‑mount package. It integrates on‑chip L1 caches and MMUs and is targeted at embedded host and I/O processing roles.
Designed as a cost‑effective, low‑power, highly integrated PowerQUICC II Pro processor, the MPC8313E addresses printing & imaging, consumer and industrial applications plus networking use cases such as switches, line cards, WLAN, NAS and VPN routers by combining CPU performance with fast interfaces and compact packaging.
Key Features
- Core and Performance – PowerPC e300c3 core running at 400 MHz with on‑chip instruction and data L1 caches and integrated memory management units (MMUs).
- Memory Support – Integrated DDR/DDR2 SDRAM memory controller compatible with DDR1 and DDR2 memory technologies for flexible system memory choices.
- Ethernet Connectivity – Dual enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps interfaces for high‑throughput networking applications.
- USB Interface – USB 2.0 support with integrated PHY for peripheral connectivity.
- Security and Crypto – On‑chip security engine (SEC 2.2) providing cryptography capabilities to support secure communications and data protection.
- Peripheral Interfaces – Integrated serial and peripheral controllers including DUART, I²C, SPI and JTAG connectivity as documented in the hardware specification.
- System Integration – Enhanced local bus controller and other integrated I/O reduce external glue logic and simplify board design.
- Package and Temperature – 516‑TEPBGA (27×27) exposed‑pad BBGA package, surface mount; industrial operating temperature range from -40 °C to 105 °C.
- Qualification and Compliance – Industrial qualification and RoHS compliance for regulated manufacturing environments.
Typical Applications
- Networking Equipment – Ideal for switches, line cards and intelligent NICs where dual Gigabit Ethernet and integrated peripherals simplify board design.
- Network Appliances – Suitable for NAS, VPN routers and WLAN devices that require integrated security, USB connectivity and DDR memory support.
- Printing & Imaging Systems – Acts as a host CPU or I/O processor in printing and imaging platforms, leveraging integrated bus and memory controllers.
- Industrial Controllers – Industrial automation and control applications benefit from the industrial temperature range and on‑chip integration for compact, reliable designs.
Unique Advantages
- Highly integrated platform: On‑chip Ethernet controllers, DDR/DDR2 memory controller, USB 2.0 PHY and peripheral interfaces reduce external components and BOM complexity.
- Security engine on‑board: SEC 2.2 cryptography support enables hardware‑accelerated security functions for protected communications and storage.
- Industrial readiness: Rated for operation from -40 °C to 105 °C and qualified for industrial applications, supporting deployment in harsh environments.
- Compact packaging: 516‑TEPBGA exposed‑pad package provides a small footprint and thermal path for dense embedded system designs.
- Documented hardware platform: Extensive hardware specifications and datasheet content are available to accelerate development and reduce time‑to‑market.
Why Choose MPC8313ECZQAGDC?
The MPC8313ECZQAGDC combines a PowerPC e300c3 core with a broad set of integrated controllers and interfaces to deliver a compact, low‑power embedded processing solution for networking, printing, consumer and industrial systems. Its industrial temperature rating and on‑chip security and memory subsystems make it suitable for designs that require reliable operation and integrated connectivity.
This part is well suited to engineers and procurement teams seeking a documented, NXP‑based hardware platform that balances CPU performance, peripheral integration and industrial qualification for long‑life embedded designs.
Request a quote or submit a sourcing inquiry for the MPC8313ECZQAGDC to receive pricing and availability information tailored to your project needs.

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