MPC8313EVRADDC

IC MPU POWERQUICC II PRO 516PBGA
Part Description

Microprocessor IC * 516-TEPBGA (27x27)

Quantity 1,210 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN5A002A1Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitPackage / Case516-BBGA Exposed PadQualificationConsumer
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
USBUSB 2.0 + PHY (1)

Overview of MPC8313EVRADDC – IC MPU POWERQUICC II PRO 516PBGA

The MPC8313EVRADDC is a PowerQUICC II Pro microprocessor IC based on the PowerPC e300c3 core. It delivers a single 32-bit core with on-chip MMU and 16 Kbytes each of L1 instruction and data cache, designed for embedded host and I/O processing tasks.

Targeted at printing and imaging, consumer and industrial applications, this device emphasizes integration, lower power operation and faster interfaces with on-chip memory controllers, dual Ethernet controllers and a security co-processor to address networking and system control use cases.

Key Features

  • Core PowerPC e300c3 core with a single 32‑bit processing core; includes 16 KB L1 instruction and 16 KB L1 data caches and on‑chip MMUs as described in the product documentation.
  • Security Co-processor Integrated security co-processor (SEC 2.2) providing cryptography capabilities and offloading security tasks from the main core.
  • Memory Interfaces On‑chip DDR/DDR2 SDRAM controller supporting system memory integration with DDR1/DDR2 support noted in the datasheet.
  • Ethernet Two enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps operation to enable wired networking and high‑throughput I/O.
  • USB Integrated USB 2.0 controller with PHY (single port) for peripheral connectivity.
  • System Interfaces Enhanced local bus and peripheral interfaces described in the technical documentation for system integration and external device connectivity.
  • Package & Mounting 516‑TEPBGA supplier device package (27 × 27 mm), 516‑BBGA with exposed pad; surface‑mount device suitable for compact embedded board designs.
  • Qualification & Compliance Listed as Consumer qualification and RoHS compliant.
  • Graphics No dedicated graphics acceleration—focused on CPU, I/O and control functions.

Typical Applications

  • Printing and Imaging Main CPU and I/O processor roles in printing systems where on‑chip memory controllers and peripheral interfaces simplify system design.
  • Networking & Communications Switches, line cards, NAS, VPN routers and intelligent NICs leveraging dual 10/100/1000 Mbps Ethernet controllers and integrated security to handle network traffic and secure data paths.
  • Wireless Infrastructure Wireless LAN (WLAN) systems that require integrated processing, memory interface support and I/O for radio control and packet handling.
  • Industrial Control Industrial controllers and embedded automation systems that benefit from the device’s integrated interfaces, security engine and surface‑mount BGA packaging.

Unique Advantages

  • Integrated I/O and Memory Subsystems On‑chip DDR/DDR2 controller and enhanced local bus reduce external components and simplify board layout.
  • Dual Gigabit Ethernet Two 10/100/1000 Mbps Ethernet controllers enable high‑throughput networking without relying on external NICs.
  • Dedicated Security Engine SEC 2.2 co‑processor provides cryptographic acceleration to offload the main core and improve system throughput for secure communications.
  • Compact Surface‑Mount Package 516‑TEPBGA (27 × 27 mm) package with exposed pad supports space‑constrained embedded designs and thermal management approaches.
  • Developer‑Oriented Architecture PowerPC e300c3 core with L1 caches and MMU supports conventional embedded OS and software models referenced in the technical documentation.
  • Regulatory and Environmental Compliance RoHS compliance supports environmental requirements for consumer and industrial markets.

Why Choose MPC8313EVRADDC?

The MPC8313EVRADDC positions itself as a highly integrated PowerQUICC II Pro processor that combines a PowerPC e300c3 core, dual gigabit Ethernet, DDR/DDR2 memory support and a security co‑processor into a compact 516‑BGA package. Its integration targets designers seeking to reduce BOM complexity and accelerate time‑to‑market for networking, printing, consumer and industrial embedded systems.

Engineers building systems that require deterministic control, secure communications and consolidated I/O will find the MPC8313EVRADDC suited for applications where integration, on‑chip memory interfaces and wired networking are priority design drivers.

Request a quote or submit an inquiry to obtain pricing, availability and delivery details for the MPC8313EVRADDC and to discuss how this PowerQUICC II Pro processor can fit your next embedded design.

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