MPC8313ECZQAFFC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 604 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 NXP | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA Exposed Pad | RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 333MHz | ||
| Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313ECZQAFFC – PowerPC e300c3 Microprocessor, 333 MHz, 516-TEPBGA
The MPC8313ECZQAFFC is a single-core PowerPC e300c3 microprocessor running at 333 MHz, packaged in a 516-TEPBGA (27×27) surface-mount package. The e300c3 core includes 16 KB of L1 instruction and data caches and on-chip memory management, delivering a compact, integrated processing solution for embedded systems.
Designed as a cost-effective, low-power, highly integrated host processor, this device targets printing and imaging, consumer, industrial and networking applications. It combines on-chip DDR/DDR2 memory controllers, dual three-speed Ethernet controllers, USB 2.0 with PHY and hardware security acceleration to address time-to-market, power and board-space constraints.
Key Features
- Core & Performance PowerPC e300c3 single 32-bit core operating at 333 MHz with on-chip MMU and 16 KB L1 instruction and data caches.
- Memory Integrated DDR and DDR2 SDRAM controllers for flexible system memory configurations.
- High-speed Networking Dual enhanced three-speed Ethernet controllers supporting 10/100/1000 Mbps for robust wired connectivity options.
- USB & Serial I/O USB 2.0 with PHY (1) plus DUART and other serial interfaces for peripheral and control connectivity.
- Security Engine On-chip security support with SEC 2.2 cryptography acceleration for secure data handling.
- Peripheral & System Interfaces Rich peripheral set documented in the device specification including enhanced local bus, PCI, HSSI, I2C, SPI, GPIO and timers.
- Package & Mounting 516-TEPBGA (27×27) exposed-pad BGA, surface-mount package optimized for compact, high-density board designs.
- Industrial Qualification & Temperature Industrial-qualified device rated for operation from −40 °C to 105 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Printing and Imaging Systems Main CPU or I/O processor for printers and imaging devices requiring integrated memory and I/O support.
- Networking Equipment Switches, line cards, NAS and VPN routers leveraging dual 10/100/1000 Mbps Ethernet controllers and the on-chip security engine.
- Wireless and Consumer Devices Host processing for wireless LAN and consumer networking products that benefit from USB and high-speed serial interfaces.
- Industrial Controllers Industrial control applications requiring extended temperature operation and a compact, highly integrated processor solution.
Unique Advantages
- Highly integrated platform: Combines CPU core, memory controllers, dual Ethernet, USB PHY and multiple peripheral interfaces to reduce BOM and board complexity.
- Security acceleration onboard: SEC 2.2 cryptography engine provides hardware-accelerated security functions for protected communications and data processing.
- Industrial-ready thermal range: −40 °C to 105 °C rating and industrial qualification support deployment in demanding environments.
- Compact BGA package: 516-TEPBGA (27×27) exposed-pad package enables dense layouts and minimizes PCB footprint.
- Cost-effective, low-power design: Positioned to address power and price targets while delivering integrated functionality for faster time-to-market.
Why Choose MPC8313ECZQAFFC?
The MPC8313ECZQAFFC delivers a balanced combination of integration, connectivity and security in a single-core PowerPC e300c3 processor. Its blend of DDR/DDR2 memory support, dual Gigabit Ethernet, USB 2.0 with PHY and hardware cryptography makes it well suited for embedded networking, printing, consumer and industrial designs that demand compact, reliable processing.
Backed by the PowerQUICC class documentation and designed for industrial operation, this part is a practical choice for engineers seeking to streamline board-level design, reduce component count and deliver robust, long-term solutions.
Request a quote or submit an inquiry for availability and lead-time to evaluate MPC8313ECZQAFFC for your next embedded design.

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