MPC8313ECZQAFFC

IC MPU MPC83XX 333MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27)

Quantity 604 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN5A002A1 NXPEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGA Exposed PadRAM ControllersDDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptographySpeed333MHz
Supplier Device Package516-TEPBGA (27×27)USBUSB 2.0 + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8313ECZQAFFC – PowerPC e300c3 Microprocessor, 333 MHz, 516-TEPBGA

The MPC8313ECZQAFFC is a single-core PowerPC e300c3 microprocessor running at 333 MHz, packaged in a 516-TEPBGA (27×27) surface-mount package. The e300c3 core includes 16 KB of L1 instruction and data caches and on-chip memory management, delivering a compact, integrated processing solution for embedded systems.

Designed as a cost-effective, low-power, highly integrated host processor, this device targets printing and imaging, consumer, industrial and networking applications. It combines on-chip DDR/DDR2 memory controllers, dual three-speed Ethernet controllers, USB 2.0 with PHY and hardware security acceleration to address time-to-market, power and board-space constraints.

Key Features

  • Core & Performance  PowerPC e300c3 single 32-bit core operating at 333 MHz with on-chip MMU and 16 KB L1 instruction and data caches.
  • Memory  Integrated DDR and DDR2 SDRAM controllers for flexible system memory configurations.
  • High-speed Networking  Dual enhanced three-speed Ethernet controllers supporting 10/100/1000 Mbps for robust wired connectivity options.
  • USB & Serial I/O  USB 2.0 with PHY (1) plus DUART and other serial interfaces for peripheral and control connectivity.
  • Security Engine  On-chip security support with SEC 2.2 cryptography acceleration for secure data handling.
  • Peripheral & System Interfaces  Rich peripheral set documented in the device specification including enhanced local bus, PCI, HSSI, I2C, SPI, GPIO and timers.
  • Package & Mounting  516-TEPBGA (27×27) exposed-pad BGA, surface-mount package optimized for compact, high-density board designs.
  • Industrial Qualification & Temperature  Industrial-qualified device rated for operation from −40 °C to 105 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Printing and Imaging Systems  Main CPU or I/O processor for printers and imaging devices requiring integrated memory and I/O support.
  • Networking Equipment  Switches, line cards, NAS and VPN routers leveraging dual 10/100/1000 Mbps Ethernet controllers and the on-chip security engine.
  • Wireless and Consumer Devices  Host processing for wireless LAN and consumer networking products that benefit from USB and high-speed serial interfaces.
  • Industrial Controllers  Industrial control applications requiring extended temperature operation and a compact, highly integrated processor solution.

Unique Advantages

  • Highly integrated platform: Combines CPU core, memory controllers, dual Ethernet, USB PHY and multiple peripheral interfaces to reduce BOM and board complexity.
  • Security acceleration onboard: SEC 2.2 cryptography engine provides hardware-accelerated security functions for protected communications and data processing.
  • Industrial-ready thermal range: −40 °C to 105 °C rating and industrial qualification support deployment in demanding environments.
  • Compact BGA package: 516-TEPBGA (27×27) exposed-pad package enables dense layouts and minimizes PCB footprint.
  • Cost-effective, low-power design: Positioned to address power and price targets while delivering integrated functionality for faster time-to-market.

Why Choose MPC8313ECZQAFFC?

The MPC8313ECZQAFFC delivers a balanced combination of integration, connectivity and security in a single-core PowerPC e300c3 processor. Its blend of DDR/DDR2 memory support, dual Gigabit Ethernet, USB 2.0 with PHY and hardware cryptography makes it well suited for embedded networking, printing, consumer and industrial designs that demand compact, reliable processing.

Backed by the PowerQUICC class documentation and designed for industrial operation, this part is a practical choice for engineers seeking to streamline board-level design, reduce component count and deliver robust, long-term solutions.

Request a quote or submit an inquiry for availability and lead-time to evaluate MPC8313ECZQAFFC for your next embedded design.

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