MPC8313ECVRAFFB

IC MPU MPC83XX 333MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27)

Quantity 892 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 105°CPackage / CaseTray
Speed333MHzVoltage1.8V, 2.5V, 3.3V

Overview of MPC8313ECVRAFFB – IC MPU MPC83XX 333MHZ 516TEPBGA

The MPC8313ECVRAFFB is a PowerPC e300c3-based microprocessor from NXP Semiconductors, implemented as a single 32-bit core running at 333 MHz. Designed as a cost-effective, low-power, and highly integrated host processor, it targets embedded applications where integrated networking, memory interfaces, and security acceleration are required.

Typical use cases include printing and imaging systems, networking equipment, wireless and storage access devices, and industrial controllers where a compact package and on-chip connectivity simplify system design and time-to-market.

Key Features

  • Core and Performance  PowerPC e300c3 core operating at 333 MHz with on-chip memory management and L1 instruction and data caches for deterministic embedded processing.
  • Memory Subsystem  Integrated controllers for DDR and DDR2 SDRAM to support system memory and high-throughput buffering.
  • Networking  Dual three-speed Ethernet interfaces (10/100/1000 Mbps) for robust wired connectivity and multi-port networking designs.
  • USB and Peripheral I/O  USB 2.0 controller with onboard PHY to support host or device USB connectivity and common peripheral interfacing.
  • Security and Acceleration  On-chip cryptography support and SEC 2.2 security coprocessor functionality to accelerate secure communications and data protection tasks.
  • Expandability and System Interfaces  Enhanced local bus, PCI, serial interfaces and multiple peripheral controllers documented in the device datasheet for flexible system integration.
  • Package and Mounting  516-TEPBGA (27×27 mm) supplier package, surface-mount, supplied in tray format for production assembly.
  • Industrial Qualification  Specified for industrial applications to meet the needs of embedded OEM designs.

Typical Applications

  • Printing and Imaging  Acts as a host CPU or I/O processor in printers and imaging systems, providing integrated memory and peripheral controllers to drive complex workflows.
  • Networking Equipment  Used in switches, line cards, and intelligent NICs where dual gigabit Ethernet and secure packet processing are required.
  • Wireless and Access Devices  Suitable for WLAN gateways and VPN routers that need integrated USB, Ethernet, and security acceleration.
  • Storage and NAS  Fits networked storage and NAS controllers that require DDR memory interfaces and network throughput.
  • Industrial Controllers  Embedded control and automation systems benefit from the industrial qualification and integrated I/O and timing resources.

Unique Advantages

  • Highly integrated connectivity: Dual 10/100/1000 Mbps Ethernet ports plus USB 2.0 with PHY reduce external components and simplify board design.
  • Security acceleration on-chip: SEC 2.2 cryptography support enables hardware-accelerated secure communications without adding external security engines.
  • Memory flexibility: On-chip DDR/DDR2 controllers allow designers to choose memory types to match performance and cost targets.
  • Compact BGA package: 516-TEPBGA (27×27) package provides a space-efficient footprint for dense embedded boards.
  • Documented processor family: Device features and system integration details are covered in the MPC8313E PowerQUICC II Pro processor datasheet to support design and validation.
  • Industrial-grade offering: Qualification for industrial use suits long-running embedded deployments.

Why Choose MPC8313ECVRAFFB?

The MPC8313ECVRAFFB delivers an integrated single-core PowerPC e300c3 solution combining network interfaces, DDR memory controllers, USB connectivity, and on-chip security acceleration in a compact BGA package. This configuration is well suited to embedded OEMs who need a balance of processing capability, on-chip peripherals, and industrial qualification to streamline BOM and board complexity.

Backed by NXP Semiconductors documentation and the PowerQUICC II Pro family design guidance, the MPC8313ECVRAFFB is appropriate for customers building networking, imaging, storage, and industrial control systems that require predictable performance, integrated connectivity, and hardware security features.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC8313ECVRAFFB and to discuss how it fits your embedded design requirements.

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