MPC8313CZQAGDC

IC MPU MPC83XX 400MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 516-TEPBGA (27x27)

Quantity 1,847 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)ECCN3A991A2
Ethernet10/100/1000Mbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case516-BBGA Exposed Pad
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
Speed400MHzSupplier Device Package516-TEPBGA (27×27)USBUSB 2.0 + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8313CZQAGDC – IC MPU MPC83XX 400MHz 516-TEPBGA

The MPC8313CZQAGDC is a single-core 32-bit PowerPC e300c3 microprocessor operating at 400 MHz, offered in a 516-TEPBGA (27×27) package. It is a cost-effective, low-power, highly integrated PowerQUICC II Pro class host processor suited for embedded designs in printing and imaging, networking, consumer, and industrial markets.

Delivering on-chip memory management and L1 caches alongside a broad set of high-speed interfaces and security capabilities, this device targets applications that require integrated networking, memory, and peripheral control with industrial temperature qualification.

Key Features

  • Core and Performance — PowerPC e300c3 single 32-bit core at 400 MHz with 16 KB L1 instruction and 16 KB L1 data caches for deterministic embedded processing.
  • Memory Support — On-chip controllers for DDR and DDR2 SDRAM, enabling flexible external memory configurations for runtime data and system code.
  • Networking — Dual enhanced three-speed Ethernet controllers supporting 10/100/1000 Mbps operation, suitable for high-throughput networked applications.
  • USB — Integrated USB 2.0 controller with PHY (1) for host/device connectivity and peripheral interfacing.
  • Security — Integrated security co-processor (SEC 2.2) and cryptography features to support secure communications and data protection.
  • Peripheral Set — Rich I/O including DUART, Enhanced Local Bus, PCI, JTAG, I2C, SPI, timers and GPIO as documented in the product hardware specification.
  • Package and Mounting — 516-BBGA exposed pad, supplied as a 516-TEPBGA (27×27) surface-mount package for compact board designs.
  • Industrial Qualification and Temperature Range — Industrial qualification with an operating temperature range of −40 °C to 105 °C for robust field deployment.
  • Low-Power, Highly Integrated Design — Described as cost-effective and low-power within the PowerQUICC II Pro family, balancing integration and efficiency for embedded host processing.

Typical Applications

  • Networking Equipment — Dual Gigabit Ethernet and integrated PCI/High-speed interfaces make it appropriate for switches, line cards, VPN routers, and intelligent NICs.
  • Storage and Access Devices — Suitable for NAS and network access servers where protocol processing and secure connectivity are required.
  • Printing and Imaging — Designed for use as main CPUs or I/O processors in printing systems and imaging devices that need integrated memory and peripheral control.
  • Industrial Control — Industrial controllers benefiting from industrial temperature range, robust I/O and secure communications.

Unique Advantages

  • Highly Integrated Solution: Combines CPU core, memory controllers, dual Ethernet, USB and a broad peripheral set to reduce system BOM and simplify board design.
  • Security-Ready: On-chip SEC 2.2 security co-processor and cryptography capabilities enable secure network and storage applications.
  • Industrial-Grade Operation: Industrial qualification and −40 °C to 105 °C operating range support deployment in demanding environments.
  • Flexible Memory Options: DDR and DDR2 SDRAM controller support offers flexibility for memory tuning across application needs.
  • Compact, Surface-Mount Package: 516-TEPBGA (27×27) with exposed pad supports dense board layouts and thermal management strategies.
  • Proven Processor Family: Part of the PowerQUICC II Pro family, extending the line with higher CPU performance and faster interfaces for legacy and new designs.

Why Choose MPC8313CZQAGDC?

The MPC8313CZQAGDC positions itself as a practical, integrated embedded host processor combining a PowerPC e300c3 core with extensive I/O, dual Gigabit Ethernet, DDR/DDR2 memory support and on-chip security. Its cost-effective, low-power design and industrial qualification make it well suited to networking, storage, printing, and industrial control applications that demand reliable field operation.

As a member of the PowerQUICC II Pro family, this device offers a clear upgrade path within a supported processor ecosystem, helping designers scale solutions while leveraging the processor’s integration to simplify board-level design and reduce component count.

Request a quote or submit your design requirements to receive pricing and availability for the MPC8313CZQAGDC. Our team can provide further technical details and help evaluate suitability for your embedded application.

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