 | | MPC8313ECVRADDB | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 587 | |
 | | MPC8313ECVRADDC | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 383 | |
 | | MPC8313ECVRAFF | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,004 | |
 | | MPC8313ECVRAFFB | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 57 | |
 | | MPC8313ECVRAFFC | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1,082 | |
 | | MPC8313ECVRAGDC | NXP Semiconductors | IC MPU POWERQUICC II PRO 516PBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | N/A | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 2.2 | 216 | |
 | | MPC8313ECZQADDC | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 951 | |
 | | MPC8313ECZQAFFC | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 202 | |
 | | MPC8313ECZQAGDC | NXP Semiconductors | IC MPU MPC83XX 400MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 269 | |
 | | MPC8313EVRADDB | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 973 | |
 | | MPC8313EVRADDC | NXP Semiconductors | IC MPU POWERQUICC II PRO 516PBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | N/A | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 2.2 | 107 | |
 | | MPC8313EVRAFF | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 618 | |
 | | MPC8313EVRAFFB | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 948 | |
 | | MPC8313EVRAFFC | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1,362 | |
 | | MPC8313EVRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 709 | |
 | | MPC8313EVRAGDC | NXP Semiconductors | IC MPU POWERQUICC II PRO 516PBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | N/A | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 2.2 | 448 | |
| N/A | | MPC8313EZQADDC | NXP Semiconductors | IC MPU MPC83XX 267MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1,662 | |
 | | MPC8313EZQAFFB | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 425 | |
 | | MPC8313EZQAFFC | NXP Semiconductors | IC MPU MPC83XX 333MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 1,307 | |
 | | MPC8313EZQAGDC | NXP Semiconductors | IC MPU MPC83XX 400MHZ 516TEPBGA | Microprocessors | 516-TEPBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27) | 954 | |