MPC8313EVRAGDC
| Part Description |
Microprocessor IC * 516-TEPBGA (27x27) |
|---|---|
| Quantity | 1,036 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Package / Case | 516-BBGA Exposed Pad | Qualification | Consumer | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| USB | USB 2.0 + PHY (1) |
Overview of MPC8313EVRAGDC – IC MPU POWERQUICC II PRO 516PBGA
The MPC8313EVRAGDC is a highly integrated microprocessor based on the PowerPC e300c3 core, designed for embedded applications in printing and imaging, consumer, and industrial markets. It combines a single 32-bit core with on-chip caches, memory controllers and high-speed I/O to address host CPU and I/O processor roles in networking, storage and control systems.
With dual three-speed Ethernet, DDR/DDR2 memory interfaces, USB 2.0 with PHY and on-chip security, the device targets designs that require efficient system integration, deterministic connectivity and hardware cryptography support.
Key Features
- CPU Core PowerPC e300c3 core, single 32‑bit core architecture suitable for embedded host and I/O processing.
- On‑chip Memory & MMU Includes 16 Kbytes L1 instruction and 16 Kbytes L1 data caches and integrated memory management units for deterministic code and data handling.
- Security Co‑processor Integrated Security (SEC 2.2) co‑processor providing cryptography and security acceleration capabilities.
- Memory Controllers Supports DDR and DDR2 SDRAM memory interfaces for flexible system memory configurations.
- Ethernet Connectivity Dual enhanced three‑speed 10/100/1000 Mbps Ethernet controllers (2 ports) for high‑throughput networking and I/O applications.
- USB USB 2.0 controller with integrated PHY (1) for host/device connectivity.
- Peripheral & System Interfaces On‑chip enhanced local bus, PCI support and a range of serial and peripheral controllers documented in the technical specification.
- Package & Mounting 516‑TEPBGA supplier package (27 × 27 mm) with 516‑BBGA exposed pad; surface mount compatibility for compact board designs.
- Qualification & Compliance Consumer qualification and RoHS compliance for lead‑free manufacturing and environmental requirements.
Typical Applications
- Printing and Imaging Acts as a main CPU or I/O processor in printers and imaging equipment, leveraging its memory interfaces and peripheral set for control and data handling.
- Networking Equipment Suited for switches, line cards and intelligent NIC designs that require dual Gigabit Ethernet and hardware security acceleration.
- Storage and NAS Used in NAS and storage access servers where DDR/DDR2 memory support and USB connectivity are needed for data throughput and expandability.
- Wireless and VPN Routers Provides the processing, Ethernet and security capabilities needed for WLAN equipment and VPN routers.
- Industrial Controllers Embedded control applications benefit from the on‑chip MMU, caches and deterministic I/O interfaces for real‑time tasks.
Unique Advantages
- Integrated Connectivity: Dual three‑speed Gigabit Ethernet and USB 2.0 with PHY reduce external component count for networked embedded systems.
- Hardware Security Acceleration: SEC 2.2 coprocessor provides on‑chip cryptography to offload security workloads from the CPU core.
- Flexible Memory Support: DDR and DDR2 SDRAM controller support enables designers to choose memory technology that matches performance and cost targets.
- Compact, Production‑ready Package: 516‑TEPBGA (27×27) with exposed pad and surface mount compatibility supports space‑efficient board layouts.
- Documentation and Platform Details: Comprehensive hardware specifications and block‑level details are provided in the processor documentation for system design and validation.
- Regulatory Readiness: RoHS compliance supports lead‑free manufacturing and global environmental requirements.
Why Choose MPC8313EVRAGDC?
The MPC8313EVRAGDC positions itself as a balanced, integrated processor option for embedded designs that require a single PowerPC e300c3 core combined with robust connectivity, memory interfacing and security acceleration. Its mix of dual Gigabit Ethernet, DDR/DDR2 support, USB 2.0 with PHY and on‑chip SEC 2.2 makes it appropriate for networking, storage, printing and industrial applications where system integration and predictable I/O are priorities.
Designed and supported by NXP Semiconductors, the device is accompanied by detailed technical documentation and hardware specifications to streamline system design, validation and production deployment for consumer and industrial embedded projects.
Request a quote or submit a pricing inquiry to evaluate the MPC8313EVRAGDC for your next embedded design or production program.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016