MPC8313EZQADDC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 585 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 NXP | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA Exposed Pad | RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 267MHz | ||
| Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313EZQADDC – IC MPU MPC83XX 267MHZ 516TEPBGA
The MPC8313EZQADDC is a PowerPC e300c3 microprocessor IC from NXP Semiconductors, operating at 267 MHz with a single 32-bit core. It is a cost-effective, low-power, highly integrated host processor designed for embedded applications across printing, imaging, consumer and industrial markets.
As part of the MPC8313 family (PowerQUICC II Pro), the device integrates on-chip caching and memory management, multi-protocol connectivity and a hardware security engine to address networking, I/O and control-oriented designs.
Key Features
- Core PowerPC e300c3 single 32-bit core running at 267 MHz; includes 16 KB L1 instruction and 16 KB L1 data caches and on-chip memory management units (MMUs).
- Memory Integrated DDR / DDR2 SDRAM controller providing support for common synchronous DRAM interfaces.
- Connectivity Dual enhanced three-speed 10/100/1000 Mbps Ethernet controllers, USB 2.0 with integrated PHY (1), DUART and a broad set of peripheral interfaces referenced in the hardware specification (PCI, I2C, SPI, HSSI).
- Security Security coprocessor (SEC 2.2) and cryptography features for embedded secure communications and data protection.
- Integration & Performance Highly integrated PowerQUICC II Pro architecture that combines CPU, I/O controllers and peripheral subsystems to reduce system BOM and board-level complexity.
- Package & Mounting 516-TEPBGA package (27 × 27 mm) with exposed pad, 516-BBGA footprint and surface-mount mounting type.
- Thermal & Qualification Operational temperature range 0 °C to 105 °C and consumer qualification; RoHS compliant.
Typical Applications
- Networking equipment Dual three-speed Ethernet controllers and integrated I/O make this device suitable for network access servers, VPN routers, switches and intelligent NIC designs.
- Printing and imaging Serves as a main CPU or I/O processor in printing systems and imaging products where integrated memory and peripheral controllers simplify system design.
- Storage and NAS DDR/DDR2 support and robust peripheral connectivity enable use as a controller in NAS and storage gateway applications.
- Industrial controllers Single-core deterministic processing, integrated interfaces and broad operating temperature support make it applicable to industrial control and line card applications.
Unique Advantages
- Highly integrated architecture: Combines CPU, on-chip MMU and caches, DDR/DDR2 memory controller, multi-speed Ethernet controllers and USB PHY to reduce external component count.
- Security-capable platform: Built-in SEC 2.2 cryptography engine provides on-chip security acceleration for embedded secure communications.
- Network-ready connectivity: Dual 10/100/1000 Mbps Ethernet controllers and USB 2.0 PHY enable compact networked endpoints and gateway designs.
- Compact BGA package: 516-TEPBGA (27 × 27 mm) with exposed pad supports high-density board layouts and effective thermal conduction.
- Designed for embedded markets: Consumer qualification and RoHS compliance align with volume embedded product requirements.
Why Choose MPC8313EZQADDC?
The MPC8313EZQADDC positions itself as a compact, integrated processing solution for embedded designs that require combined CPU performance, memory subsystem support and multi-protocol connectivity. Its PowerPC e300c3 core with on-chip caches and MMU, paired with dual three-speed Ethernet controllers and a dedicated security engine, provides a balanced platform for networking, printing, storage and industrial control applications.
Engineers and product teams seeking a cost-effective, low-power host processor with integrated peripherals and a compact BGA footprint will find the MPC8313EZQADDC suitable for designs where component integration and predictable thermal/operating behavior matter.
Request a quote or submit an inquiry to obtain pricing and availability for the MPC8313EZQADDC and to discuss how it fits your project requirements. Consult the product datasheet for detailed hardware specifications and integration guidance.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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