MPC8313EZQAGDC

The MPC8313EZQAGDC is a PowerPC e300c3-based microprocessor offering a single 32-bit core clocked at 400 MHz in a 516-TEPBGA (27×27) package. Designed as a cost-effective, low-power, highly integrated host processor, it addresses embedded designs across printing and imaging, consumer, and industrial markets.

On-chip integration includes memory management, cache, security and multiple high-speed I/O options—providing a compact solution for main CPUs and I/O processors in networking, storage and industrial control applications.

Key Features

• Core and Performance  PowerPC e300c3 core, single 32-bit core running at 400 MHz with on-chip MMUs and 16 Kbytes of L1 instruction and 16 Kbytes of L1 data cache.
• Security  Security co-processor SEC 2.2 with cryptography capabilities for embedded security functions.
• Memory Subsystem  DDR1/DDR2 SDRAM memory controller support for flexible external memory options.
• Ethernet and Networking  Two enhanced three-speed 10/100/1000 Mbps Ethernet controllers (dual Gigabit-capable ports) for high-throughput networking.
• USB and Serial I/O  USB 2.0 controller with PHY (1) plus DUART and additional serial peripherals for common host/device connectivity.
• Peripheral and System Interfaces  Integrated support for Enhanced Local Bus, PCI, I2C, SPI, JTAG, timers, GPIO and other system interfaces documented in the device specification.
• Package and Mounting  516-BBGA exposed pad, supplier device package 516-TEPBGA (27×27), surface-mount construction for compact board-level integration.
• Operating Range and Compliance  Rated for 0 °C to 105 °C operating temperature and RoHS compliant; consumer-qualified device.

Typical Applications

• Printing and Imaging  Acts as a main CPU or I/O processor in printers and multifunction devices, handling control and networked I/O tasks.
• Networking Equipment  Suitable for switches, line cards and intelligent NICs that require dual Gigabit Ethernet and packet-handling capability.
• Wireless and NAS Devices  Provides processing and peripheral I/O for WLAN systems, network attached storage and VPN routers.
• Industrial Controllers  Used in industrial control applications where a robust embedded processor with security and high-speed I/O is required.

Unique Advantages

• Highly integrated networking and memory controllers: Dual 10/100/1000 Mbps Ethernet controllers and DDR1/DDR2 SDRAM controller reduce external components and simplify board design.
• Security-ready architecture: SEC 2.2 security co-processor and cryptography features enable secure embedded networking and storage functions.
• Compact BGA package: 516-TEPBGA (27×27) with exposed pad allows dense board layouts while supporting surface-mount assembly.
• Embedded-focused peripherals: Rich peripheral set including USB 2.0 with PHY, DUART, PCI, I2C, SPI and GPIO supports diverse I/O and system requirements.
• Validated system-level documentation: Detailed datasheet and hardware specification cover DDR, Ethernet, HSSI, USB, bus interfaces and thermal/system design information to speed integration.
• RoHS compliant and consumer qualified: Meets regulatory and qualification needs for consumer and many embedded product lines.

Why Choose MPC8313EZQAGDC?

The MPC8313EZQAGDC combines a PowerPC e300c3 core with integrated memory controllers, dual Gigabit Ethernet and a hardware security engine to deliver a compact, integrated embedded processing platform. Its blend of connectivity, security and on-chip system features makes it well suited to networking, print/imaging, storage and industrial controller designs that require a balance of performance and integration.

With NXP Semiconductors documentation and system design guidance, the MPC8313EZQAGDC provides a verifiable platform for developers and procurement teams targeting reliable, space-efficient embedded systems that leverage on-chip peripherals to reduce BOM and accelerate time to market.

Request a quote or submit a procurement inquiry to obtain pricing, lead times and availability for the MPC8313EZQAGDC. Technical documentation and datasheet details are available to support your evaluation and design-in process.