MPC8313EZQAFFC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 696 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 NXP | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA Exposed Pad | RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 333MHz | ||
| Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313EZQAFFC – PowerPC e300c3 Microprocessor, 333 MHz, 516‑TEPBGA
The MPC8313EZQAFFC is a PowerQUICC II Pro class microprocessor based on the PowerPC e300c3 core. It delivers a single 32‑bit core running at 333 MHz with integrated L1 caches and on‑chip memory management features.
Designed for cost‑sensitive, low‑power, highly integrated embedded systems, this device addresses printing and imaging, consumer and industrial systems, networking switches and line cards, WLAN, NAS and VPN routers, intelligent NICs and industrial controllers by combining CPU performance with broad I/O and security capabilities.
Key Features
- Core PowerPC e300c3 core running at 333 MHz with on‑chip L1 instruction and data caches.
- Processing Single 32‑bit core architecture suitable for control and host‑processor roles in embedded systems.
- Memory Support On‑chip DDR and DDR2 SDRAM controller support for system memory interfacing.
- Security & Cryptography Integrated security co‑processor (SEC 2.2) with cryptography features for secure data handling.
- Ethernet Connectivity Dual enhanced three‑speed 10/100/1000 Mbps Ethernet controllers (2) for wired network interfaces.
- USB USB 2.0 interface with integrated PHY (1) for host or peripheral connectivity.
- Peripheral Interfaces DUART and enhanced local bus controller support as part of the on‑chip peripheral set.
- Package & Mounting 516‑TEPBGA (27×27) exposed‑pad BGA, surface mount packaging for compact board implementation.
- Operating Range Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- Printing & Imaging Host CPU and I/O processor in printers and imaging equipment, leveraging integrated memory and Ethernet interfaces.
- Networking Equipment Switches, line cards and intelligent NICs using the dual three‑speed Ethernet controllers for wired network throughput and management.
- Storage & VPN Devices NAS and VPN routers that require integrated CPU, security (SEC 2.2) and DDR/DDR2 memory interfaces.
- Wireless Infrastructure Wireless LAN systems that benefit from the combination of processing, memory controller support and peripheral connectivity.
- Industrial Controllers Embedded control and I/O processing in industrial controllers where integrated interfaces and a compact BGA package are required.
Unique Advantages
- Integrated networking and I/O: Dual 10/100/1000 Mbps Ethernet controllers plus USB 2.0 + PHY and DDR/DDR2 memory controller simplify system integration for networked devices.
- Hardware security: Built‑in SEC 2.2 security co‑processor and cryptography features enable hardware‑accelerated secure processing for networking and storage applications.
- Compact system footprint: 516‑TEPBGA (27×27) exposed‑pad BGA and surface‑mount compatibility support dense PCB layouts and compact product designs.
- Consumer qualification with wide thermal margin: Consumer‑qualified device rated 0 °C to 105 °C for deployment in a variety of embedded environments.
- PowerQUICC II Pro family continuity: Part of the PowerQUICC family, extending the series with higher CPU performance and faster interfaces to meet time‑to‑market, power and package size constraints.
Why Choose MPC8313EZQAFFC?
The MPC8313EZQAFFC combines a PowerPC e300c3 core with integrated DDR/DDR2 memory controllers, dual gigabit Ethernet, USB 2.0 + PHY and hardware security in a compact 516‑TEPBGA package. This balance of processing, connectivity and security makes it well suited for embedded designs that require integrated networking and secure data handling without extensive external logic.
As an extension of the PowerQUICC II Pro family, the device targets designs where time‑to‑market, power consumption and package footprint matter. It is a practical choice for engineers building connected consumer and industrial products, networking appliances and storage or VPN systems that need moderate CPU performance with broad I/O integration.
Request a quote or submit a pricing inquiry to obtain availability and ordering information for the MPC8313EZQAFFC.

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