MPC8313EZQAFFB

IC MPU MPC83XX 333MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27)

Quantity 137 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C – 105°CPackage / CaseTray
Speed333MHzVoltage1.8V, 2.5V, 3.3V

Overview of MPC8313EZQAFFB – IC MPU MPC83XX 333MHZ 516TEPBGA

The MPC8313EZQAFFB is a PowerPC e300c3-based microprocessor in the MPC8313 family, delivering a single 32-bit core operating at 333 MHz. It is a cost-effective, low-power, highly integrated host processor targeted at printing/imaging, consumer and industrial applications that require on-chip I/O and networking functionality.

Designed for embedded designs, the device combines the e300c3 core with on-chip memory management, Ethernet controllers, DDR/DDR2 memory interface and USB support to simplify system design and accelerate time-to-market.

Key Features

  • Core — PowerPC e300c3 single 32-bit core running at 333 MHz with on-chip MMU and 16 KB instruction and 16 KB data L1 caches.
  • Memory — Integrated DDR and DDR2 SDRAM memory controller for system DRAM connectivity.
  • Ethernet — Dual enhanced three-speed 10/100/1000 Mbps Ethernet controllers (two ports) for high-throughput networking.
  • USB — USB 2.0 controller with integrated PHY (one) for host/device connectivity.
  • Security — On-chip security co-processor (SEC 2.2) and cryptography features to support secure data handling.
  • Peripheral and System Interfaces — Integrated controllers and interfaces documented in the device specification include enhanced local bus, PCI, HSSI, DUART, JTAG, I2C, SPI, timers and GPIO.
  • Package & Mounting — 516-TEPBGA surface-mount package, 27×27 mm footprint.
  • Qualification — Consumer-grade qualification as listed in the product specifications.

Typical Applications

  • Printing & Imaging — Host CPU or I/O processor in printers and imaging systems, leveraging integrated memory and I/O controllers for compact system designs.
  • Networking Equipment — Switching, line cards and intelligent NIC functions using dual 10/100/1000 Mbps Ethernet controllers for wired connectivity.
  • Network Appliances — NAS, VPN routers and wireless LAN systems where on-chip Ethernet, DDR/DDR2 support and USB simplify platform integration.
  • Industrial Controllers — Embedded control applications that benefit from integrated serial interfaces, timers and GPIO for deterministic I/O handling.

Unique Advantages

  • Highly integrated solution: On-chip DDR/DDR2 memory controller, dual GbE controllers and USB 2.0 + PHY reduce external components and simplify board design.
  • Security acceleration: SEC 2.2 and cryptography features provide built-in capabilities for secure communications and data protection.
  • Embedded-ready core: PowerPC e300c3 with L1 caches and MMU offers a familiar, efficient architecture for embedded operating systems and real-time stacks.
  • Broad peripheral set: Support for enhanced local bus, PCI, HSSI, serial interfaces, timers and GPIO enables flexible system partitioning and peripheral integration.
  • Compact package: 516-TEPBGA (27×27) surface-mount package enables dense board layouts while providing substantial I/O connectivity.
  • Cost- and power-conscious: Described in product documentation as a cost-effective, low-power option for embedded host processing roles.

Why Choose MPC8313EZQAFFB?

The MPC8313EZQAFFB positions itself as an integrated, embedded host processor that balances compute, connectivity and system integration. With the e300c3 core, on-chip caches and memory management, plus dual GbE, DDR/DDR2 support and USB connectivity, it is suited to designers seeking a compact solution that consolidates multiple system functions.

This device is appropriate for teams developing consumer, industrial and networking products that require reduced BOM complexity and robust interface options, and is supported by detailed documentation covering hardware specifications, interfaces and thermal/system design guidance.

Request a quote or submit a pricing inquiry to evaluate MPC8313EZQAFFB for your next embedded design.

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