MPC8313VRADDC

IC MPU POWERQUICC II PRO 516PBGA
Part Description

Microprocessor IC * 516-TEPBGA (27x27)

Quantity 1,508 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitPackage / Case516-BBGA Exposed PadQualificationConsumer
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
USBUSB 2.0 + PHY (1)

Overview of MPC8313VRADDC – IC MPU POWERQUICC II PRO 516PBGA

The MPC8313VRADDC is a PowerQUICC II Pro microprocessor from NXP Semiconductors based on the PowerPC e300c3 core. It is a cost-effective, low-power, highly integrated host processor designed for embedded markets that demand networked I/O and memory performance.

Targeted use cases include printing and imaging, consumer and industrial applications, and a variety of networking roles such as switches, line cards, WLAN systems, NAS/VPN routers, and intelligent NICs. The device combines a single 32-bit core with integrated memory controllers and multi‑port connectivity to simplify system design and accelerate time-to-market.

Key Features

  • Core Architecture PowerPC e300c3 core with on-chip memory management and 16 KB L1 instruction and 16 KB L1 data caches for deterministic embedded performance.
  • CPU Configuration Single 32-bit core providing a compact processing element for control and I/O offload tasks.
  • Security Engine (SEC 2.2) Integrated security co‑processor for cryptographic operations, helping offload security workloads from the main core.
  • Memory Interfaces Built-in DDR and DDR2 SDRAM controllers to support modern system memory topologies.
  • High‑Speed Ethernet Dual enhanced three‑speed 10/100/1000 Mbps Ethernet controllers for robust, multi-port networking.
  • USB USB 2.0 controller with integrated PHY to support host or device USB 2.0 connectivity.
  • On‑chip Peripherals Includes enhanced local bus, PCI support and common serial/peripheral interfaces documented in the device hardware specification.
  • Package & Mounting 516‑TEPBGA (27 × 27 mm) supplier device package with exposed pad; surface-mount mounting type suitable for compact PCB layouts.
  • Environmental Compliance RoHS‑compliant manufacturing status for regulatory and assembly compatibility.
  • Qualification Market qualification: Consumer, suitable for a wide range of commercial embedded products.

Typical Applications

  • Printing & Imaging Main CPU or I/O processor in printers and multifunction devices where integrated memory and I/O simplify system design.
  • Network Switches & Line Cards Control and management processor for networking equipment leveraging dual gigabit Ethernet ports.
  • Wireless LAN Systems Host processor for WLAN access points and bridges requiring integrated connectivity and memory support.
  • NAS & VPN Routers Storage and routing platforms that benefit from on‑chip security acceleration and multiple high‑speed interfaces.
  • Industrial Controllers Embedded controllers in industrial automation where compact packaging and integrated peripherals reduce BOM complexity.

Unique Advantages

  • Highly integrated design: Combines a PowerPC core, DDR/DDR2 memory controller, dual gigabit Ethernet, USB 2.0 with PHY and security engine to minimize external components.
  • Security acceleration: Built‑in SEC 2.2 cryptography co‑processor offloads encryption tasks for secure networking and storage applications.
  • Flexible memory support: Native DDR and DDR2 controller support provides options for memory performance and cost tradeoffs.
  • Compact packaging: 516‑TEPBGA (27 × 27 mm) exposed‑pad BGA enables dense PCB implementations while supporting thermal paths for the device.
  • Designed for networking use-cases: Dual enhanced 10/100/1000 Mbps Ethernet ports and on‑chip peripheral set simplify design of networked appliances.
  • Regulatory readiness: RoHS compliance supports contemporary assembly and environmental requirements.

Why Choose MPC8313VRADDC?

The MPC8313VRADDC positions itself as a balanced embedded processor combining PowerPC e300c3 performance with broad on‑chip integration—memory controllers, dual gigabit Ethernet, USB 2.0 with PHY and a hardware security engine—reducing system complexity and BOM count. Its single 32‑bit core and compact 516‑TEPBGA package make it appropriate for space‑constrained embedded and networking designs.

Backed by NXP Semiconductors’ PowerQUICC II Pro family documentation and hardware specifications, the MPC8313VRADDC is suited to designers seeking a cost‑effective, low‑power host processor for printing, consumer, industrial and networking products that require integrated connectivity and security features.

Request a quote or submit an RFQ to discuss availability, pricing and lead times for the MPC8313VRADDC.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up