MPC8313VRAFFC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 369 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 516-BBGA Exposed Pad | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 333MHz | Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313VRAFFC – IC MPU MPC83XX 333MHZ 516TEPBGA
The MPC8313VRAFFC is a PowerPC e300c3-based microprocessor from the MPC8313 series, delivering a single 32-bit core at 333 MHz in a compact 516-TEPBGA (27×27) package. Designed as a cost-effective, low-power, highly integrated host processor, it targets printing and imaging, consumer and industrial systems, and networking applications that require integrated I/O and secure processing.
On-chip integration includes memory controllers and multi-gigabit networking and peripheral interfaces, making the device suitable for main CPU and I/O processor roles where performance, integration, and predictable thermal behavior are important.
Key Features
- Core: PowerPC e300c3 single 32-bit core running at 333 MHz, with on-chip instruction and data cache and MMU support as part of the MPC83xx architecture.
- Memory Controllers: Integrated DDR and DDR2 SDRAM controllers for flexible system memory choices and straightforward memory subsystem design.
- Ethernet: Dual three-speed 10/100/1000 Mbps Ethernet controllers to support differentiated networking and switching roles.
- USB: USB 2.0 controller with integrated PHY (1) for host/peripheral connectivity.
- Security: On-chip security engine (SEC 2.2) with cryptography features to support secure data handling and accelerated security operations.
- Peripheral Interfaces: DUART and other standard peripheral interfaces for serial control and system management.
- Package & Mounting: 516-BBGA exposed pad, supplied in a 516-TEPBGA (27×27) surface-mount package suitable for compact, high-density boards.
- Operating Range: Rated for 0 °C to 105 °C operating temperature, suitable for many consumer and industrial environments.
- Compliance: RoHS compliant and qualified for consumer applications.
Typical Applications
- Networking Equipment: Ideal for switches, line cards, NAS units, VPN routers and intelligent NICs where dual Gigabit Ethernet and integrated I/O simplify system design.
- Printing and Imaging Systems: Suited for main CPU and I/O processor roles in printers and imaging devices that benefit from integrated memory controllers and peripheral interfaces.
- Wireless and Access Devices: Applicable to WLAN access points and network access servers requiring a compact, integrated processor with robust networking and USB support.
- Industrial Controllers: Useful in industrial control systems that require secure processing, serial interfaces, and operation across a broad temperature range.
Unique Advantages
- Highly integrated networking and I/O: Dual Gigabit Ethernet controllers plus USB 2.0 with PHY reduce external components and simplify board-level design.
- On-chip security engine (SEC 2.2): Built-in cryptography support accelerates secure communications and offloads security tasks from the CPU core.
- Flexible memory support: DDR and DDR2 SDRAM controller support enables designers to choose the memory technology that best fits cost and performance targets.
- Compact BGA package: 516-TEPBGA (27×27) with exposed pad enables high-density, thermally efficient board layouts for space-constrained designs.
- Designed for low-power, cost-sensitive systems: Described as a cost-effective, low-power option within the MPC83xx PowerQUICC II Pro family for embedded host and I/O roles.
- Consumer qualification and RoHS compliance: Streamlines regulatory and procurement requirements for consumer-focused products.
Why Choose MPC8313VRAFFC?
The MPC8313VRAFFC combines a proven PowerPC e300c3 core at 333 MHz with integrated memory, security, and multi-gigabit networking to deliver a balanced platform for embedded host and I/O processing. Its integration and package choices make it suited to compact, cost-sensitive designs in networking, imaging, wireless access, and industrial control.
As part of the MPC8313/MPC83xx family, the device offers a clear migration path and predictable system-level behavior for engineers building on the PowerQUICC II Pro architecture, delivering scalability and integration for long-term product plans.
Request a quote or submit an inquiry to receive pricing and availability for MPC8313VRAFFC and to discuss how this device fits your next embedded design.

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