MPC8313ZQADDC
| Part Description |
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27) |
|---|---|
| Quantity | 54 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 516-BBGA Exposed Pad | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | ||
| Speed | 267MHz | Supplier Device Package | 516-TEPBGA (27×27) | USB | USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8313ZQADDC – IC MPU MPC83XX 267MHZ 516TEPBGA
The MPC8313ZQADDC is a PowerPC e300c3-based microprocessor IC offering a single 32-bit core running at 267 MHz in a 516-TEPBGA (27×27) surface-mount package. It integrates on-chip memory management and L1 caches to deliver a compact host-processor solution for embedded systems.
Designed as a cost-effective, low-power, highly integrated device, the MPC8313ZQADDC targets printing and imaging, consumer and industrial systems, and a range of networking applications where integrated Ethernet, DDR memory support, USB connectivity and built-in security accelerate time-to-market and reduce system BOM.
Key Features
- Core & Performance Powered by the PowerPC e300c3 core, single 32-bit core running at 267 MHz with 16 KB L1 instruction and 16 KB L1 data caches and on-chip MMUs for deterministic embedded performance.
- Memory Integrated DDR/DDR2 SDRAM memory controller to support common external memory configurations for system and application data.
- Networking & I/O Dual enhanced three-speed 10/100/1000 Mbps Ethernet controllers provide two Gigabit-capable ports; includes a USB 2.0 controller with PHY and DUART for serial console or control interfaces.
- Peripheral Integration Includes an enhanced local bus controller and peripheral interfaces (PCI support present in the device family) to simplify connection of external devices and expansion.
- Security On-chip security subsystem (SEC 2.2) and cryptography capabilities for embedded secure communications and data protection.
- Package & Thermal 516-BBGA exposed-pad, supplier device package 516-TEPBGA (27×27), surface-mount package; specified operating temperature range 0 °C to 105 °C. RoHS compliant.
- Design Efficiency Described in the product documentation as a cost-effective, low-power, highly integrated host processor—helpful for reducing board-level complexity and power budget in embedded designs.
Typical Applications
- Printing & Imaging Acts as a main CPU or I/O processor in printers and imaging systems, leveraging integrated memory and I/O to handle control and data-path tasks.
- Networking & Communications Suitable for networking switches, line cards, NAS devices and VPN routers where dual Ethernet ports and cryptographic support enable routed and secure traffic handling.
- Wireless & Consumer Networking Can be used in WLAN and consumer networking equipment that require integrated USB and Ethernet connectivity with on-chip processing.
- Industrial Control Applies to industrial controllers and embedded consumer/industrial systems where a compact, single-chip processor with deterministic performance is required.
Unique Advantages
- Highly integrated connectivity: Dual 10/100/1000 Mbps Ethernet ports plus USB 2.0 and DUART reduce the number of external controllers required on the board.
- On-chip memory support: DDR/DDR2 controller integration simplifies memory subsystem design and reduces external component count.
- Built-in security engine: SEC 2.2 and cryptography features enable secure communications and data protection without a separate security IC.
- Compact, manufacturable package: 516-TEPBGA (27×27) exposed-pad BGA supports surface-mount assembly and thermal management for embedded platforms.
- Cost- and power-conscious design: Described as a low-power, cost-effective processor option, helping lower BOM and operating power for embedded applications.
- Vendor lineage: Part of the PowerQUICC II Pro family from NXP Semiconductors, providing continuity within an established embedded processor family.
Why Choose MPC8313ZQADDC?
The MPC8313ZQADDC positions itself as a balanced embedded host processor combining a PowerPC e300c3 core, integrated memory controller, dual Gigabit-capable Ethernet, USB 2.0 with PHY and on-chip security. Its integration and low-power design make it suitable for designers targeting compact, connected embedded systems in printing, networking, consumer and industrial markets.
With a practical operating temperature range and a 516-TEPBGA exposed-pad package, the device supports board-level thermal and assembly needs while helping to reduce BOM and simplify system design. As a member of the PowerQUICC II Pro family from NXP Semiconductors, it provides a stable, documented platform for long-term embedded deployments.
Request a quote or submit a product inquiry today to get pricing and availability information for the MPC8313ZQADDC.

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Headquarters: Eindhoven, North Brabant, Netherlands
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