MPC8313ZQADDC

IC MPU MPC83XX 267MHZ 516TEPBGA
Part Description

PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27)

Quantity 54 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)ECCN3A991A2
Ethernet10/100/1000Mbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case516-BBGA Exposed Pad
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
Speed267MHzSupplier Device Package516-TEPBGA (27×27)USBUSB 2.0 + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8313ZQADDC – IC MPU MPC83XX 267MHZ 516TEPBGA

The MPC8313ZQADDC is a PowerPC e300c3-based microprocessor IC offering a single 32-bit core running at 267 MHz in a 516-TEPBGA (27×27) surface-mount package. It integrates on-chip memory management and L1 caches to deliver a compact host-processor solution for embedded systems.

Designed as a cost-effective, low-power, highly integrated device, the MPC8313ZQADDC targets printing and imaging, consumer and industrial systems, and a range of networking applications where integrated Ethernet, DDR memory support, USB connectivity and built-in security accelerate time-to-market and reduce system BOM.

Key Features

  • Core & Performance  Powered by the PowerPC e300c3 core, single 32-bit core running at 267 MHz with 16 KB L1 instruction and 16 KB L1 data caches and on-chip MMUs for deterministic embedded performance.
  • Memory  Integrated DDR/DDR2 SDRAM memory controller to support common external memory configurations for system and application data.
  • Networking & I/O  Dual enhanced three-speed 10/100/1000 Mbps Ethernet controllers provide two Gigabit-capable ports; includes a USB 2.0 controller with PHY and DUART for serial console or control interfaces.
  • Peripheral Integration  Includes an enhanced local bus controller and peripheral interfaces (PCI support present in the device family) to simplify connection of external devices and expansion.
  • Security  On-chip security subsystem (SEC 2.2) and cryptography capabilities for embedded secure communications and data protection.
  • Package & Thermal  516-BBGA exposed-pad, supplier device package 516-TEPBGA (27×27), surface-mount package; specified operating temperature range 0 °C to 105 °C. RoHS compliant.
  • Design Efficiency  Described in the product documentation as a cost-effective, low-power, highly integrated host processor—helpful for reducing board-level complexity and power budget in embedded designs.

Typical Applications

  • Printing & Imaging  Acts as a main CPU or I/O processor in printers and imaging systems, leveraging integrated memory and I/O to handle control and data-path tasks.
  • Networking & Communications  Suitable for networking switches, line cards, NAS devices and VPN routers where dual Ethernet ports and cryptographic support enable routed and secure traffic handling.
  • Wireless & Consumer Networking  Can be used in WLAN and consumer networking equipment that require integrated USB and Ethernet connectivity with on-chip processing.
  • Industrial Control  Applies to industrial controllers and embedded consumer/industrial systems where a compact, single-chip processor with deterministic performance is required.

Unique Advantages

  • Highly integrated connectivity: Dual 10/100/1000 Mbps Ethernet ports plus USB 2.0 and DUART reduce the number of external controllers required on the board.
  • On-chip memory support: DDR/DDR2 controller integration simplifies memory subsystem design and reduces external component count.
  • Built-in security engine: SEC 2.2 and cryptography features enable secure communications and data protection without a separate security IC.
  • Compact, manufacturable package: 516-TEPBGA (27×27) exposed-pad BGA supports surface-mount assembly and thermal management for embedded platforms.
  • Cost- and power-conscious design: Described as a low-power, cost-effective processor option, helping lower BOM and operating power for embedded applications.
  • Vendor lineage: Part of the PowerQUICC II Pro family from NXP Semiconductors, providing continuity within an established embedded processor family.

Why Choose MPC8313ZQADDC?

The MPC8313ZQADDC positions itself as a balanced embedded host processor combining a PowerPC e300c3 core, integrated memory controller, dual Gigabit-capable Ethernet, USB 2.0 with PHY and on-chip security. Its integration and low-power design make it suitable for designers targeting compact, connected embedded systems in printing, networking, consumer and industrial markets.

With a practical operating temperature range and a 516-TEPBGA exposed-pad package, the device supports board-level thermal and assembly needs while helping to reduce BOM and simplify system design. As a member of the PowerQUICC II Pro family from NXP Semiconductors, it provides a stable, documented platform for long-term embedded deployments.

Request a quote or submit a product inquiry today to get pricing and availability information for the MPC8313ZQADDC.

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