MPC8313VRAGDC
| Part Description |
Microprocessor IC * 516-TEPBGA (27x27) |
|---|---|
| Quantity | 752 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8313 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 2.2 | Core Processor | PowerPC e300c3 | Device Package | 516-TEPBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Package / Case | 516-BBGA Exposed Pad | Qualification | Consumer | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| USB | USB 2.0 + PHY (1) |
Overview of MPC8313VRAGDC – IC MPU POWERQUICC II PRO 516PBGA
The MPC8313VRAGDC is a highly integrated PowerQUICC II Pro microprocessor based on the PowerPC e300c3 core. It combines a single 32-bit core with on-chip memory management and performance-oriented peripherals to address cost-sensitive, low-power embedded designs.
Designed for a range of printing, imaging, consumer and industrial use cases, the device emphasizes integration and flexible I/O, including dual three-speed Ethernet controllers, DDR/DDR2 memory support, on-chip security, and USB 2.0 connectivity.
Key Features
- Core architecture PowerPC e300c3 core with single 32‑bit processing engine; on‑chip MMU and L1 caches to support embedded control tasks.
- On‑chip caches Includes 16 KB instruction and 16 KB data L1 caches for improved instruction throughput and data access efficiency.
- Security subsystem Integrated security co-processor (SEC 2.2) providing cryptography acceleration and hardware support for secure processing.
- Memory controllers Built‑in DDR and DDR2 SDRAM controllers for flexible system memory choices and straightforward board design.
- Ethernet Dual enhanced three‑speed Ethernet controllers supporting 10/100/1000 Mbps interfaces for high‑throughput networking applications.
- USB USB 2.0 controller with integrated PHY for host or device connectivity without an external PHY.
- Rich peripheral set Series documentation identifies DUART, high‑speed serial interfaces, Enhanced Local Bus, PCI, I2C, SPI, timers and GPIO for broad I/O and system control options.
- Package and mounting 516‑TEPBGA (27 × 27 mm) exposed‑pad BGA package, surface‑mount for compact, thermally efficient system integration.
- Qualification Consumer qualification as specified in the product data.
- Compliance RoHS compliant.
Typical Applications
- Printing and imaging systems Acts as a host CPU or I/O processor, leveraging integrated controllers and memory interfaces for document handling and device control.
- Networking equipment Suitable for switches, line cards and intelligent NIC designs that require dual gigabit Ethernet and on‑chip packet processing support.
- Wireless and access devices Applicable to WLAN systems, NAS and VPN routers where integrated USB, memory controllers and security acceleration simplify system architecture.
- Industrial controllers Provides a compact compute and I/O integration point for automation and control applications that benefit from its embedded peripherals and deterministic interfaces.
Unique Advantages
- Highly integrated platform: Combines CPU, memory controllers, dual gigabit Ethernet and USB 2.0 in a single device to reduce external components and BOM complexity.
- Hardware security acceleration: On‑chip SEC 2.2 cryptography block offloads secure processing tasks and helps streamline secure communications and data protection.
- Flexible memory support: DDR and DDR2 controllers provide designers with options to match performance and cost objectives.
- Compact thermal package: 516‑TEPBGA exposed‑pad package supports surface‑mount assembly and thermal management in space‑constrained designs.
- Documented architecture: Detailed processor hardware specifications and datasheet coverage enable predictable integration and system validation.
Why Choose MPC8313VRAGDC?
The MPC8313VRAGDC positions itself as a cost‑effective, low‑power, and highly integrated microprocessor solution for embedded systems requiring networked I/O, secure processing and flexible memory options. Its PowerPC e300c3 core combined with dual gigabit Ethernet, USB 2.0 with PHY, and an on‑chip security engine make it appropriate for designs spanning printing, networking, consumer and industrial markets.
Design teams looking to simplify board-level complexity while retaining a robust set of peripherals and documented hardware specifications will find the MPC8313VRAGDC a practical choice for mid-range embedded applications that emphasize integration and reliable system-level features.
Request a quote or submit a pricing and availability inquiry to receive lead-time and order information for the MPC8313VRAGDC.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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