MPC8313ZQAFFC

IC MPU POWERQUICC II PRO 516PBGA
Part Description

Microprocessor IC * 516-TEPBGA (27x27)

Quantity 1,156 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8313
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 2.2Core ProcessorPowerPC e300c3Device Package516-TEPBGA (27x27)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitPackage / Case516-BBGA Exposed PadQualificationConsumer
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
USBUSB 2.0 + PHY (1)

Overview of MPC8313ZQAFFC – IC MPU POWERQUICC II PRO 516PBGA

The MPC8313ZQAFFC is a single‑core PowerQUICC II Pro microprocessor based on the PowerPC e300c3 core. It is a cost‑effective, low‑power, highly integrated host processor suitable for printing/imaging, consumer and industrial applications that require integrated networking, memory and security functions.

Built with on‑chip instruction and data caches and memory management units, the device targets designs that need integrated Ethernet, DDR/DDR2 memory support, USB connectivity and cryptography capabilities in a compact 516‑TEPBGA (27×27) package.

Key Features

  • Core PowerPC e300c3 core; single 32‑bit core suitable for embedded host and I/O processing.
  • On‑chip caches and MMU Includes 16 Kbyte L1 instruction and 16 Kbyte L1 data caches and on‑chip memory management units (MMUs) for efficient code and data handling.
  • Security engine (SEC 2.2) Integrated security co‑processor with cryptography features to support secure data processing and networking functions.
  • Memory controllers DDR and DDR2 SDRAM memory controller support for system memory flexibility.
  • Dual Gigabit Ethernet Two enhanced three‑speed 10/100/1000 Mbps Ethernet controllers for high‑throughput networking applications.
  • USB connectivity USB 2.0 controller with integrated PHY (1) for peripheral and host connectivity.
  • Peripheral interfaces On‑chip peripherals and controllers referenced in the product documentation include enhanced local bus, DUART, HSSI, PCI, I2C, SPI, JTAG, timers, GPIO and more for broad system connectivity.
  • Package and mounting 516‑BBGA exposed pad, supplier device package 516‑TEPBGA (27×27); surface mount package suitable for compact system designs.
  • Qualification and compliance Consumer qualification; RoHS compliant.

Typical Applications

  • Printing and Imaging: Acts as a main CPU or I/O processor in printing systems where integrated memory controllers and peripheral interfaces simplify system design.
  • Networking Equipment: Suitable for switches, line cards, NAS and VPN routers that require dual 10/100/1000 Mbps Ethernet controllers and on‑chip security acceleration.
  • Wireless and Access Devices: Fits WLAN and intelligent NIC designs that need USB connectivity, high‑speed serial interfaces and integrated networking.
  • Industrial Controllers: Used in industrial control and automation applications benefiting from a compact BGA package, multiple I/O interfaces and DDR/DDR2 memory support.

Unique Advantages

  • Highly integrated networking: Dual three‑speed Gigabit Ethernet controllers provide direct, on‑chip networking capability to reduce external components.
  • Built‑in security acceleration: SEC 2.2 security co‑processor and cryptography features enable hardware‑assisted secure data handling and networking.
  • Flexible memory support: DDR and DDR2 SDRAM controller support allows designers to choose memory technology based on system cost and performance targets.
  • Compact system footprint: 516‑TEPBGA (27×27) exposed‑pad BGA package delivers a high density, surface‑mount solution for space‑constrained designs.
  • Processor efficiency: e300c3 core with dedicated L1 instruction and data caches and MMUs improves code execution efficiency and memory access performance.
  • Standards‑oriented I/O set: Integrated USB 2.0 + PHY and extensive peripheral interfaces simplify board design and reduce BOM complexity.

Why Choose MPC8313ZQAFFC?

The MPC8313ZQAFFC combines the PowerPC e300c3 core with integrated Ethernet, memory controllers, security acceleration and a comprehensive set of peripheral interfaces in a compact 516‑TEPBGA (27×27) package. This combination positions the device for embedded designs that require networking, secure data processing and flexible memory options while minimizing external components.

Ideal for OEMs and system designers targeting printing/imaging, networking, wireless access and industrial control applications, the MPC8313ZQAFFC offers a balanced mix of integration, efficiency and consumer qualification to support reliable product designs.

Request a quote or submit a procurement inquiry to get pricing, availability and lead‑time information for the MPC8313ZQAFFC.

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