 | | MPC8314VRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 645 | |
 | | MPC8315CVRADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,207 | |
 | | MPC8315CVRAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,546 | |
 | | MPC8315CVRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 523 | |
 | | MPC8315ECVRADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,452 | |
 | | MPC8315ECVRAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 165 | |
 | | MPC8315ECVRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 753 | |
 | | MPC8315EVRADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 179 | |
 | | MPC8315EVRAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 311 | |
 | | MPC8315EVRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 272 | |
 | | MPC8315VRADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 110 | |
 | | MPC8315VRAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 863 | |
 | | MPC8321CVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 532 | |
 | | MPC8321CVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,674 | |
 | | MPC8321CVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 980 | |
 | | MPC8321CVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 54 | |
 | | MPC8321CZQADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,114 | |
 | | MPC8321CZQAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,084 | |
 | | MPC8321ECVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 675 | |
 | | MPC8321ECVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,209 | |