Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Total Products: 134,052

Image	Part Number	Manufacturer	Description	Category	Device Package	Voltage	Operating Temp	Additional Specifications	Qty	Get A Quote
	MPC8313VRADDB	NXP Semiconductors	IC MPU MPC83XX 267MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	1.8V, 2.5V, 3.3V	0°C – 105°C	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz Mounting Type: Surface Mount	292	GET A QUOTE
	MPC8313VRADDC	NXP Semiconductors	IC MPU POWERQUICC II PRO 516PBGA	Microprocessors	516-TEPBGA (27x27)	N/A	N/A	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Graphics Acceleration: No Co-Processors/DSP: Security; SEC 2.2 Qualification: Consumer	888	GET A QUOTE
	MPC8313VRAFF	NXP Semiconductors	IC MPU MPC83XX 333MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	1.8V, 2.5V, 3.3V	0°C – 105°C	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount	1,319	GET A QUOTE
	MPC8313VRAFFB	NXP Semiconductors	IC MPU MPC83XX 333MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	1.8V, 2.5V, 3.3V	0°C – 105°C	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount	1,204	GET A QUOTE
	MPC8313VRAFFC	NXP Semiconductors	IC MPU MPC83XX 333MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27)	1,195	GET A QUOTE
	MPC8313VRAGDC	NXP Semiconductors	IC MPU POWERQUICC II PRO 516PBGA	Microprocessors	516-TEPBGA (27x27)	N/A	N/A	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Graphics Acceleration: No Co-Processors/DSP: Security; SEC 2.2 Qualification: Consumer	1,718	GET A QUOTE
N/A	MPC8313ZQADDC	NXP Semiconductors	IC MPU MPC83XX 267MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27)	987	GET A QUOTE
	MPC8313ZQAFFC	NXP Semiconductors	IC MPU POWERQUICC II PRO 516PBGA	Microprocessors	516-TEPBGA (27x27)	N/A	N/A	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Graphics Acceleration: No Co-Processors/DSP: Security; SEC 2.2 Qualification: Consumer	26	GET A QUOTE
	MPC8313ZQAGDC	NXP Semiconductors	IC MPU MPC83XX 400MHZ 516TEPBGA	Microprocessors	516-TEPBGA (27x27)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27×27)	466	GET A QUOTE
	MPC8314CVRADDA	NXP Semiconductors	IC MPU MPC83XX 266MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	554	GET A QUOTE
	MPC8314CVRAFDA	NXP Semiconductors	IC MPU MPC83XX 333MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	425	GET A QUOTE
	MPC8314CVRAGDA	NXP Semiconductors	IC MPU MPC83XX 400MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	1,144	GET A QUOTE
	MPC8314ECVRADDA	NXP Semiconductors	IC MPU MPC83XX 266MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	507	GET A QUOTE
	MPC8314ECVRAFDA	NXP Semiconductors	IC MPU MPC83XX 333MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	1,077	GET A QUOTE
	MPC8314ECVRAGDA	NXP Semiconductors	IC MPU MPC83XX 400MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	-40°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	1,039	GET A QUOTE
	MPC8314EVRADDA	NXP Semiconductors	IC MPU MPC83XX 266MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	1,462	GET A QUOTE
	MPC8314EVRAFDA	NXP Semiconductors	IC MPU MPC83XX 333MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	885	GET A QUOTE
	MPC8314EVRAGDA	NXP Semiconductors	IC MPU MPC83XX 400MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	975	GET A QUOTE
	MPC8314VRADDA	NXP Semiconductors	IC MPU MPC83XX 266MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	119	GET A QUOTE
	MPC8314VRAFDA	NXP Semiconductors	IC MPU MPC83XX 333MHZ 620HBGA	Microprocessors	620-HBGA (29x29)	N/A	0°C ~ 105°C (TA)	Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29)	1,071	GET A QUOTE