Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8321ECVRAFDCMPC8321ECVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
97
MPC8321ECVRAFDCAMPC8321ECVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
665
MPC8321ECZQADDCMPC8321ECZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
650
MPC8321ECZQAFDCMPC8321ECZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
749
MPC8321EVRADDCMPC8321EVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
817
MPC8321EVRADDCAMPC8321EVRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,077
MPC8321EVRAFDCMPC8321EVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,870
MPC8321EVRAFDCAMPC8321EVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
336
MPC8321EZQAFDCMPC8321EZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,404
MPC8321VRADDCMPC8321VRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
382
MPC8321VRADDCAMPC8321VRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
841
MPC8321VRAFDCMPC8321VRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,347
MPC8321VRAFDCAMPC8321VRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
660
MPC8321ZQADDCMPC8321ZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,978
MPC8321ZQAFDCMPC8321ZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,186
MPC8323CVRADDCMPC8323CVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
10
MPC8323CVRADDCAMPC8323CVRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
220
MPC8323CVRAFDCMPC8323CVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,257
MPC8323CVRAFDCAMPC8323CVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,795
MPC8323ECVRADDCMPC8323ECVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
746

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