 | | MPC8343CZQADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 353 | |
 | | MPC8343CZQADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 400 | |
 | | MPC8343CZQAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 614 | |
 | | MPC8343ECVRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 706 | |
 | | MPC8343ECZQADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,701 | |
 | | MPC8343ECZQAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,181 | |
 | | MPC8343EVRADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 680 | |
 | | MPC8343EVRADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,336 | |
| N/A | | MPC8343EVRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 613 | |
 | | MPC8343EZQAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 666 | |
 | | MPC8343EZQAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,531 | |
 | | MPC8343VRADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 657 | |
 | | MPC8343VRADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,802 | |
 | | MPC8343VRAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 538 | |
 | | MPC8343VRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 662 | |
 | | MPC8343ZQADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 816 | |
 | | MPC8343ZQAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,298 | |
 | | MPC8347CVRADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 765 | |
 | | MPC8347CVRAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 468 | |
 | | MPC8347CVRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,214 | |