MPC8343VRADDB

IC MPU MPC83XX 266MHZ 620HBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-HBGA (29x29)

Quantity 634 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8343
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300Device Package620-HBGA (29x29)ECCN3A991A2
Ethernet10/100/1000Mbps (3)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case620-BBGA Exposed Pad
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed266MHzSupplier Device Package620-HBGA (29×29)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8343VRADDB – IC MPU MPC83XX 266MHZ 620HBGA

The MPC8343VRADDB is a PowerPC e300-based microprocessor integrated host device from the MPC8343 series, operating at 266 MHz in a 620-HBGA (29×29) surface-mount package. It is targeted at networking, storage and general-purpose embedded applications where processor integration, on-chip system logic and secure feature support are important.

Designed with integrated memory controllers, multi-port Ethernet and USB interfaces along with hardware security features, the MPC8343VRADDB offers a compact, RoHS-compliant solution for consumer and embedded designs requiring a balanced combination of connectivity, security and system integration. Operating temperature is specified from 0 °C to 105 °C.

Key Features

  • Core PowerPC e300 processor core; single 32-bit core running at 266 MHz for embedded control and data-plane tasks.
  • Memory Subsystem On-chip controllers supporting DDR and DDR2 SDRAM for flexible system memory configurations.
  • Security Engine Dedicated SEC co-processor plus cryptography and a hardware random number generator to accelerate secure processing and key management.
  • Ethernet Connectivity Three 10/100/1000 Mbps Ethernet interfaces to support multi-port networking and high-throughput communication.
  • USB Two USB 2.0 controllers with integrated PHYs for host/device connectivity and peripheral interfacing.
  • Additional Interfaces DUART and other peripheral interfaces for serial communications and system control.
  • Package & Mounting 620-BBGA exposed pad (supplier device package: 620-HBGA, 29×29) in a surface-mount form factor suitable for compact board layouts and thermal management.
  • Environmental & Qualification RoHS compliant and qualified for consumer applications; operating temperature range 0 °C to 105 °C.

Typical Applications

  • Networking Equipment — Multi-port 10/100/1000 Ethernet interfaces make it suitable for switches, routers and access devices requiring integrated host processing and packet handling.
  • Storage & NAS — On-chip DDR/DDR2 memory controllers and integrated system logic support controller functions for consumer storage and network-attached storage devices.
  • Embedded Communication Systems — Use in gateways, protocol converters and other embedded communication appliances where connectivity, security and compact packaging are required.
  • General-Purpose Embedded Designs — Consumer and industrial-leaning embedded applications that benefit from integrated USB, serial interfaces and hardware security acceleration.

Unique Advantages

  • Integrated networking and system logic: Combines processor core with multi-port Ethernet and peripheral controllers to reduce board-level BOM and simplify system design.
  • On-chip security acceleration: Hardware SEC engine and RNG provide dedicated resources for cryptographic operations, improving performance for secure communications and data protection.
  • Memory flexibility: Support for DDR and DDR2 SDRAM allows designers to choose memory technology that matches performance and cost targets.
  • Compact thermal-capable package: 620-HBGA with exposed pad supports compact board layouts while helping thermal dissipation for sustained operation up to 105 °C.
  • Integrated USB connectivity: Dual USB 2.0 with PHY reduces the need for external PHY components and speeds time-to-market for peripheral-enabled designs.
  • RoHS compliant: Environmentally compliant manufacturing status for designs requiring lead-free components.

Why Choose MPC8343VRADDB?

The MPC8343VRADDB positions itself as a balanced, integrated host processor for consumer and embedded applications that require solid connectivity, built-in security engines and flexible memory support. Its PowerPC e300 core combined with multi-gigabit Ethernet, USB 2.0 with PHY and DDR/DDR2 controllers delivers a compact platform for networking, storage and communication designs.

Backed by the MPC8343EA family documentation and NXP’s embedded processor lineage, this device is suitable for designers seeking an integrated, RoHS-compliant solution that streamlines board-level integration while providing hardware-assisted security and interface flexibility.

Request a quote or submit an RFQ to get pricing and availability for the MPC8343VRADDB.

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