 | | MPC8323ECVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,881 | |
 | | MPC8323ECVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 191 | |
 | | MPC8323ECVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,140 | |
 | | MPC8323EVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 197 | |
 | | MPC8323EVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 311 | |
 | | MPC8323EVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,562 | |
 | | MPC8323EVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 449 | |
 | | MPC8323EZQADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 495 | |
 | | MPC8323EZQAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,352 | |
 | | MPC8323VRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 172 | |
 | | MPC8323VRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 343 | |
 | | MPC8323VRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 271 | |
 | | MPC8323VRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,149 | |
 | | MPC8323ZQADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 831 | |
 | | MPC8323ZQAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 185 | |
| N/A | | MPC8343CRADDB | NXP Semiconductors | POWERQUICC II PRO PROCESSOR | Microprocessors | 620-TEPBGA II (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-TEPBGA II (29×29) | 1,256 | |
 | | MPC8343CVRADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,017 | |
 | | MPC8343CVRADDB | NXP Semiconductors | IC MPU MPC83XX 266MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 484 | |
 | | MPC8343CVRAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 1,064 | |
 | | MPC8343CVRAGDB | NXP Semiconductors | IC MPU MPC83XX 400MHZ 620HBGA | Microprocessors | 620-HBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-HBGA (29×29) | 110 | |