MPC8309VMAGDCA

POWERQUICC POWER ARCH SOC, 400MH
Part Description

POWERQUICC POWER ARCH SOC, 400MH

Quantity 1,013 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8309
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; QUICC EngineCore ProcessorPowerPC e300c3Device Package489-PBGA (19x19)
ECCN3A991A2Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0 °C – 105 °CQualificationConsumer
RAM ControllersDDR2REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
USBUSB 2.0 (1)Voltage – I/O1.8 V – 3.3 V

Overview of MPC8309VMAGDCA – POWERQUICC POWER ARCH SOC, 400MH

The MPC8309VMAGDCA is a POWERQUICC II Pro integrated communications microprocessor built around the PowerPC e300c3 core. It delivers a single 32‑bit core design with integrated communications accelerators and a rich set of peripheral interfaces for embedded networking and control applications.

Designed as a cost‑effective, highly integrated solution, the MPC8309 targets applications such as residential gateways, modem/routers, industrial control and test & measurement, offering a balance of CPU capability, I/O integration and board‑level footprint savings.

Key Features

  • Core & Architecture PowerPC e300c3 core (MPC603e‑based); single 32‑bit core providing the processor foundation for control and packet handling.
  • Communications Offloads Integrated communications DSP functionality and a QUICC Engine to accelerate networking tasks and protocol handling.
  • Memory Subsystem DDR2 memory controller support for system memory interfacing and data buffering.
  • Ethernet & USB Three 10/100 Mbps Ethernet interfaces and one USB 2.0 interface to support multiple network ports and peripheral connectivity.
  • Peripheral Set Integrated peripheral blocks described in the device documentation include DUART, eSDHC, FlexCAN, I2C, timers, GPIO, IPIC, SPI, JTAG, PCI, HDLC and TDM/SI.
  • Package & Mounting 489‑ball PBGA (19 × 19 mm) package; surface mount device suitable for compact board layouts.
  • Qualification & Compliance Consumer qualification and RoHS compliance for regulatory and environmental alignment.
  • Operating Range Specified operating temperature from 0°C to 105°C for a range of commercial and industrial ambient conditions.
  • Graphics & Display No dedicated graphics acceleration (device is focused on communications and control functions).

Typical Applications

  • Residential Gateways: Use as the communications processor in home gateway and router designs to handle multiple Ethernet ports and USB peripheral connectivity.
  • Modem and Router Platforms: Integrate DDR2 memory support and QUICC Engine offloads to manage packet processing and protocol tasks in modem/router products.
  • Industrial Control: Leverage the e300c3 core, on‑chip peripherals and 0°C to 105°C operating range for embedded control and monitoring systems.
  • Test & Measurement Equipment: Employ the processor’s peripheral set and communications interfaces for data acquisition, protocol handling and device control functions.

Unique Advantages

  • Highly integrated communications processor: Combines an e300c3 core with a QUICC Engine and communications DSP functionality to consolidate processing and protocol offloads on a single device.
  • Multiple network interfaces: Three 10/100 Mbps Ethernet ports plus USB 2.0 simplify multi‑port networking designs and peripheral connectivity without adding separate controllers.
  • Broad peripheral coverage: On‑chip DUART, eSDHC, FlexCAN, I2C, SPI, PCI and other interfaces reduce bill‑of‑materials and simplify board design for embedded systems.
  • Compact PBGA package: 489‑ball PBGA (19 × 19 mm) provides a small footprint option for space‑constrained boards while supporting surface‑mount assembly.
  • Documented platform support: Comprehensive hardware specifications and subsystem descriptions are provided in the device documentation to assist system design and integration.
  • Regulatory alignment: RoHS compliance and consumer qualification help meet environmental and market entry requirements.

Why Choose MPC8309VMAGDCA?

The MPC8309VMAGDCA positions itself as a compact, integrated communications SoC that brings a PowerPC e300c3 core together with dedicated communications accelerators and a broad peripheral set. It is well suited to designers building mid‑range networking, control and test equipment who need multiple Ethernet interfaces, DDR2 memory support and on‑chip peripheral functionality in a single package.

Backed by detailed hardware documentation, the MPC8309VMAGDCA supports faster design iterations and clearer system integration through its documented subsystems, package information and electrical characteristics.

Request a quote or submit an inquiry to start the purchasing process for the MPC8309VMAGDCA and discuss availability and volume pricing.

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