MPC8309VMAGDCA
| Part Description |
POWERQUICC POWER ARCH SOC, 400MH |
|---|---|
| Quantity | 1,013 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8309 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; QUICC Engine | Core Processor | PowerPC e300c3 | Device Package | 489-PBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0 °C – 105 °C | Qualification | Consumer | ||
| RAM Controllers | DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | Unknown | ||
| USB | USB 2.0 (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of MPC8309VMAGDCA – POWERQUICC POWER ARCH SOC, 400MH
The MPC8309VMAGDCA is a POWERQUICC II Pro integrated communications microprocessor built around the PowerPC e300c3 core. It delivers a single 32‑bit core design with integrated communications accelerators and a rich set of peripheral interfaces for embedded networking and control applications.
Designed as a cost‑effective, highly integrated solution, the MPC8309 targets applications such as residential gateways, modem/routers, industrial control and test & measurement, offering a balance of CPU capability, I/O integration and board‑level footprint savings.
Key Features
- Core & Architecture PowerPC e300c3 core (MPC603e‑based); single 32‑bit core providing the processor foundation for control and packet handling.
- Communications Offloads Integrated communications DSP functionality and a QUICC Engine to accelerate networking tasks and protocol handling.
- Memory Subsystem DDR2 memory controller support for system memory interfacing and data buffering.
- Ethernet & USB Three 10/100 Mbps Ethernet interfaces and one USB 2.0 interface to support multiple network ports and peripheral connectivity.
- Peripheral Set Integrated peripheral blocks described in the device documentation include DUART, eSDHC, FlexCAN, I2C, timers, GPIO, IPIC, SPI, JTAG, PCI, HDLC and TDM/SI.
- Package & Mounting 489‑ball PBGA (19 × 19 mm) package; surface mount device suitable for compact board layouts.
- Qualification & Compliance Consumer qualification and RoHS compliance for regulatory and environmental alignment.
- Operating Range Specified operating temperature from 0°C to 105°C for a range of commercial and industrial ambient conditions.
- Graphics & Display No dedicated graphics acceleration (device is focused on communications and control functions).
Typical Applications
- Residential Gateways: Use as the communications processor in home gateway and router designs to handle multiple Ethernet ports and USB peripheral connectivity.
- Modem and Router Platforms: Integrate DDR2 memory support and QUICC Engine offloads to manage packet processing and protocol tasks in modem/router products.
- Industrial Control: Leverage the e300c3 core, on‑chip peripherals and 0°C to 105°C operating range for embedded control and monitoring systems.
- Test & Measurement Equipment: Employ the processor’s peripheral set and communications interfaces for data acquisition, protocol handling and device control functions.
Unique Advantages
- Highly integrated communications processor: Combines an e300c3 core with a QUICC Engine and communications DSP functionality to consolidate processing and protocol offloads on a single device.
- Multiple network interfaces: Three 10/100 Mbps Ethernet ports plus USB 2.0 simplify multi‑port networking designs and peripheral connectivity without adding separate controllers.
- Broad peripheral coverage: On‑chip DUART, eSDHC, FlexCAN, I2C, SPI, PCI and other interfaces reduce bill‑of‑materials and simplify board design for embedded systems.
- Compact PBGA package: 489‑ball PBGA (19 × 19 mm) provides a small footprint option for space‑constrained boards while supporting surface‑mount assembly.
- Documented platform support: Comprehensive hardware specifications and subsystem descriptions are provided in the device documentation to assist system design and integration.
- Regulatory alignment: RoHS compliance and consumer qualification help meet environmental and market entry requirements.
Why Choose MPC8309VMAGDCA?
The MPC8309VMAGDCA positions itself as a compact, integrated communications SoC that brings a PowerPC e300c3 core together with dedicated communications accelerators and a broad peripheral set. It is well suited to designers building mid‑range networking, control and test equipment who need multiple Ethernet interfaces, DDR2 memory support and on‑chip peripheral functionality in a single package.
Backed by detailed hardware documentation, the MPC8309VMAGDCA supports faster design iterations and clearer system integration through its documented subsystems, package information and electrical characteristics.
Request a quote or submit an inquiry to start the purchasing process for the MPC8309VMAGDCA and discuss availability and volume pricing.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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