MPC8275CZQMIBA

IC MPU MPC82XX 266MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27)

Quantity 941 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8275
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8275CZQMIBA – IC MPU MPC82XX 266MHZ PBGA516

The MPC8275CZQMIBA is a PowerPC G2_LE microprocessor in a single-core, 32-bit implementation running at 266 MHz. Designed for embedded and industrial applications, it combines a deterministic core architecture with integrated communications and memory interfaces to support networking and control-oriented designs.

Packaged in a 516-PBGA (27×27) surface-mount package and specified for an operating range of −40 °C to 105 °C, this RoHS-compliant device delivers a combination of processing performance, peripheral integration, and industrial temperature qualification for robust system designs.

Key Features

  • Core and Performance PowerPC G2_LE single core, 32-bit CPU at 266 MHz with separate 16 KB instruction and 16 KB data caches; caches are four-way set associative and physically addressed with LRU replacement.
  • Connectivity Integrated communication peripherals include three 10/100 Mbps Ethernet ports and one USB 2.0 full/low-rate interface for networked and serial device connectivity.
  • Co-processors and Controllers Communications-oriented co-processors (RISC CPM) and DSP capabilities targeted at communications tasks, alongside DRAM and SDRAM memory controller support for system memory.
  • System Interfaces Includes additional serial and control interfaces such as I2C to simplify sensor, peripheral, and management connections.
  • Power and I/O 3.3 V I/O signaling for compatibility with common embedded peripherals and board-level interfaces.
  • Packaging and Mounting 516-PBGA supplier device package (27×27) in a surface-mount form factor suitable for compact board layouts.
  • Industrial Qualification Specified for industrial operating temperature from −40 °C to 105 °C and RoHS compliant for environmental requirements.

Typical Applications

  • Industrial Networking and Gateways — Use the integrated 10/100 Mbps Ethernet ports and USB 2.0 to build rugged protocol gateways, fieldbus bridges, and network-enabled controllers.
  • Embedded Communications Equipment — Leverage the communications co-processor (RISC CPM) and DSP communications capabilities for packet processing and serial communications tasks.
  • Control and Automation Systems — The 266 MHz PowerPC core with cache architecture and DRAM/SDRAM controller support suits machine controllers and real-time supervisory applications in industrial environments.
  • Appliances and Instrumentation — Integration of common interfaces (I2C, Ethernet, USB) simplifies sensor aggregation, user I/O, and remote monitoring designs.

Unique Advantages

  • Integrated Communications Peripherals: Three 10/100 Mbps Ethernet ports plus USB 2.0 and I2C reduce external interface components and simplify board-level design.
  • Deterministic Processing with Cache: Separate 16 KB instruction and data caches with a four-way set-associative architecture support predictable execution for embedded workloads.
  • Industrial Temperature Rating: Rated from −40 °C to 105 °C, enabling deployment in harsh or temperature-variable environments.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O eases integration with a wide range of embedded peripherals and legacy interfaces.
  • Compact Surface-Mount Package: 516-PBGA (27×27) package supports high-density board layouts while maintaining necessary pin count for integrated peripherals.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose MPC8275CZQMIBA?

The MPC8275CZQMIBA is positioned for embedded and industrial designs that require a balance of communications integration, deterministic PowerPC processing, and rugged operating conditions. Its combination of a PowerPC G2_LE core, integrated Ethernet and USB interfaces, memory controller support, and industrial temperature qualification makes it a practical choice for networking, control, and instrumentation systems.

Manufactured by NXP Semiconductors as part of the MPC8275 series, this part provides a documented hardware specification set and features that help reduce BOM complexity and support reliable deployment in industrial environments.

Request a quote or submit a purchase inquiry today to evaluate the MPC8275CZQMIBA for your embedded or industrial project needs.

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