MPC8272VRTMFA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 259 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8272 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM, Security; SEC | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator | Speed | 400MHz | ||
| Supplier Device Package | 516-PBGA (27×27) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8272VRTMFA – PowerPC G2_LE 400 MHz 32‑Bit MPU, 516‑PBGA
The MPC8272VRTMFA is a single‑core PowerPC G2_LE microprocessor operating at 400 MHz in a 516‑pin PBGA (27×27) surface‑mount package. It combines a 32‑bit processor core with integrated communications and security engines to address embedded communications and networking use cases.
Designed for consumer‑qualified embedded systems, the device features dual 10/100 Mbps Ethernet ports, USB 2.0, DRAM/SDRAM controllers, and 3.3 V I/O. The on‑chip Security Engine (SEC) and random number generator provide hardware cryptography support while the modified Communications Processor Module (CPM) enables protocol offload and multi‑channel communications handling.
Key Features
- Core Dual‑issue PowerPC G2_LE single 32‑bit core running at 400 MHz with integrated MMU and separate instruction and data caches (16 KB each) as documented for the PowerQUICC II family.
- Memory Subsystem On‑chip DRAM and SDRAM controllers simplify external memory interfacing and buffering for embedded applications.
- Communications & Offload Modified Communications Processor Module (CPM) and multi‑channel controllers provide hardware assistance for serial and network protocol handling.
- Ethernet & USB Two 10/100 Mbps Ethernet interfaces and one USB 2.0 port (full/low rate) for network and peripheral connectivity.
- Security Integrated Security Engine (SEC) with cryptography support and a hardware random number generator for secure data processing.
- Peripheral Interfaces Includes I2C and other system interfaces; PCI bridge support is included in the device family.
- Power & I/O Standard 3.3 V I/O simplifies power‑rail design for common embedded systems.
- Package & Mounting 516‑PBGA (27×27) lead‑free surface‑mount package, RoHS compliant.
- Operating Range & Qualification Consumer qualification with an operating temperature range of 0 °C to 105 °C.
Typical Applications
- Embedded Communications & Networking Integrated Ethernet, CPM and protocol offload capabilities make this device suitable for embedded network controllers and communications modules.
- Secure Consumer Network Equipment On‑chip SEC and RNG support hardware encryption for secure data handling in consumer network appliances.
- Embedded Control and I/O Systems USB, I2C and memory controller integration supports designs that require local control, peripheral connectivity and buffering.
Unique Advantages
- Integrated Communications and Security: On‑chip CPM and SEC reduce external component count and simplify board design for networked embedded products.
- Proven PowerPC Core: The dual‑issue G2_LE core with MMU and 16 KB instruction/data caches provides predictable performance at 400 MHz for embedded application code.
- Rich Connectivity: Dual 10/100 Ethernet ports, USB 2.0 and I2C enable direct interfacing to common peripherals and networks without extensive external bridges.
- Memory Flexibility: Integrated DRAM/SDRAM controllers streamline memory subsystem design and accelerate data handling.
- Manufacturing and Environmental Compatibility: 516‑PBGA surface‑mount package is RoHS compliant and supports standard 3.3 V I/O conventions.
- Consumer Market Fit: Consumer qualification and a 0 °C to 105 °C operating range align the device with commercial embedded product requirements.
Why Choose MPC8272VRTMFA?
The MPC8272VRTMFA combines a PowerPC G2_LE compute core with integrated communications and security subsystems in a single 516‑pin PBGA package, offering a compact, integrated platform for consumer‑grade embedded networking and control products. Its mix of Ethernet, USB, memory controllers and on‑chip security hardware targets designs that need both protocol handling and protected data paths while minimizing external components.
Manufactured by NXP Semiconductors and provided in a RoHS‑compliant surface‑mount package with standard 3.3 V I/O, this part suits engineers building consumer embedded systems that require integrated connectivity, hardware cryptography, and a defined operating temperature range.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the MPC8272VRTMFA.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016