MPC8272ZQTIEA

IC MPU MPC82XX 400MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)

Quantity 111 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8272
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPM, Security; SECCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN5A002A1 FREEthernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed400MHz
Supplier Device Package516-PBGA (27×27)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8272ZQTIEA – IC MPU MPC82XX 400MHZ PBGA516

The MPC8272ZQTIEA is a PowerPC G2_LE microprocessor in the MPC8272 PowerQUICC II family, delivering a 400 MHz single 32‑bit core with integrated communications and security functionality. Designed for embedded applications, it combines a Power Architecture core with a modified Communications Processor Module (CPM) and an integrated Security Engine (SEC) to address networking and secure embedded control needs.

With on‑chip DRAM/SDRAM controllers, dual 10/100 Mbps Ethernet ports, USB 2.0, and I2C support, this device targets embedded systems requiring integrated connectivity, deterministic processing and hardware‑accelerated security within a surface‑mount 516‑pin PBGA package.

Key Features

  • Core & Architecture PowerPC G2_LE core, single 32‑bit processor operating at 400 MHz, supporting dual‑issue integer execution.
  • Memory Subsystem Integrated DRAM and SDRAM controllers and on‑chip memory management units (MMUs) with instruction and data caches for deterministic embedded performance.
  • Communications & Offloads Modified Communications Processor Module (RISC CPM) and multi‑channel communications controllers to offload serial and network tasks.
  • Ethernet & USB Two 10/100 Mbps Ethernet interfaces and one USB 2.0 interface provide common wired connectivity options for embedded networking devices.
  • Security Integrated Security Engine (SEC) with hardware cryptography and a Random Number Generator for encrypted communications and secure operations.
  • Peripherals & Interfaces I2C interface plus general communications interfaces provided by the CPM for system integration.
  • Power & IO 3.3 V I/O operation suitable for common embedded system designs.
  • Package & Mounting 516‑pin PBGA (27×27 mm) surface‑mount package for space‑efficient board integration.
  • Operating Range & Compliance Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance.

Typical Applications

  • Embedded Communications Ideal for networked embedded endpoints and protocol converters that require integrated Ethernet and serial I/O offload.
  • Industrial Control Suitable for control systems needing deterministic 32‑bit processing, DRAM/SDRAM support and robust I/O integration.
  • Secure Gateways Provides on‑chip cryptography and a hardware RNG for secure data handling in gateway and edge devices.
  • Network Appliances Well suited to compact routers, switches or access devices requiring dual 10/100 Ethernet ports and USB connectivity.

Unique Advantages

  • Integrated Communications and Processing: Combines a PowerPC G2_LE core with a Communications Processor Module to reduce external controller requirements and simplify designs.
  • On‑chip Security Acceleration: Hardware cryptography and a Random Number Generator accelerate secure protocols and reduce CPU load for encryption tasks.
  • Rich Connectivity: Dual 10/100 Mbps Ethernet plus USB 2.0 and I2C provide a broad set of interfaces for common embedded networking roles.
  • Memory Flexibility: Built‑in DRAM and SDRAM controllers enable straightforward system memory integration without additional controller ICs.
  • Compact Surface‑Mount Package: 516‑pin PBGA (27×27) delivers high pin count in a compact footprint for space‑constrained boards.
  • Regulatory and Environmental Compliance: RoHS‑compliant construction supports modern environmental requirements for consumer and embedded products.

Why Choose MPC8272ZQTIEA?

The MPC8272ZQTIEA positions itself as a versatile embedded processor that blends a 400 MHz PowerPC G2_LE core with integrated communications, memory controllers and hardware security—making it a pragmatic choice for networked and secure embedded designs. Its integrated peripherals and PBGA packaging reduce BOM complexity and simplify board layout for designers focused on connectivity and secure data handling.

As a member of the MPC8272 PowerQUICC II family from NXP Semiconductors, this device offers a consolidated platform for embedded applications that require deterministic processing, built‑in communication interfaces and hardware security features within a consumer‑qualified, RoHS‑compliant product.

If you would like a quote or have questions about ordering MPC8272ZQTIEA for your design, submit a request to receive pricing and availability details.

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