 | | MPC5200CVR400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,332 | |
 | | MPC5200CVR400B | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,251 | |
 | | MPC5200CVR400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 677 | |
 | | MPC5200VR400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 324 | |
 | | MPC5200VR400B | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 639 | |
 | | MPC5200VR400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | 2.5V, 3.3V | 0°C – 70°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,019 | |
 | | MPC533CVR40 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 178 | |
 | | MPC533CZP40 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,116 | |
 | | MPC534CZP40 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 1,887 | |
 | | MPC535CZP40 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 650 | |
 | | MPC536CZP40 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 20 | |
 | | MPC5517GAVMG80 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,741 | |
 | | MPC5534MVM80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 185 | |
 | | MPC5534MZQ80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 573 | |
 | | MPC5553MVR132 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 187 | |
 | | MPC5553MVZ132 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 252 | |
 | | MPC5553MZP132 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 20 | |
 | | MPC5553MZQ132 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,072 | |
 | | MPC5554AZP132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -55°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,030 | |
 | | MPC5554MVR132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,269 | |