Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC508APMPC508APTexas InstrumentsIC MUX 8:1 1.5KOHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
756
MPC508AUMPC508AUTexas InstrumentsIC MUX 8:1 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
1,383
MPC508AU/1KMPC508AU/1KTexas InstrumentsIC MUX 8:1 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
1,698
MPC508AU/1KG4MPC508AU/1KG4Texas InstrumentsIC MUX 8:1 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
1,124
MPC508AUG4MPC508AUG4Texas InstrumentsIC MUX 8:1 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
572
MPC509APMPC509APTexas InstrumentsIC SWITCH SP4T X 2 1.5KOHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
396
MPC509AUMPC509AUTexas InstrumentsIC SWITCH SP4TX2 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
610
MPC509AU/1KMPC509AU/1KTexas InstrumentsIC SWITCH SP4TX2 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
1,162
MPC509AU/1KG4MPC509AU/1KG4Texas InstrumentsIC SWITCH SP4TX2 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
729
MPC509AUG4MPC509AUG4Texas InstrumentsIC SWITCH SP4TX2 1.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
16-SOIC
804
MPC5121VY400BMPC5121VY400BNXP SemiconductorsIC MCU 32BIT ROMLESS 516FPBGAMicrocontrollers516-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
147
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
115
MPC5121YVY400BMPC5121YVY400BNXP SemiconductorsIC MCU 32BIT ROMLESS 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
147
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
738
MPC5123VY400BMPC5123VY400BNXP SemiconductorsIC MCU 32BIT ROMLESS 516FPBGAMicrocontrollers516-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
147
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
904
MPC5123YVY400BMPC5123YVY400BNXP SemiconductorsIC MCU 32BIT ROMLESS 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
147
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
511
MPC5125YVN400MPC5125YVN400NXP SemiconductorsIC MCU 32BIT ROMLESS 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
607
MPC5125YVN400RMPC5125YVN400RNXP SemiconductorsIC MCU 32BIT ROMLESS 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
1,198
MPC5200BV400MPC5200BV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
459
MPC5200CBV266MPC5200CBV266NXP SemiconductorsIC MPU MPC52XX 266MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
1,697
MPC5200CBV400MPC5200CBV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
86
MPC5200CVR266MPC5200CVR266NXP SemiconductorsIC MPU MPC52XX 266MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
417

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