 | | MPC508AP | Texas Instruments | IC MUX 8:1 1.5KOHM 16DIP | Analog Switches, Multiplexers, Demultiplexers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 25pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300″”, 7.62mm) Supplier Device Package: 16-PDIP | 756 | |
 | | MPC508AU | Texas Instruments | IC MUX 8:1 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 25pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 1,383 | |
 | | MPC508AU/1K | Texas Instruments | IC MUX 8:1 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 25pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 1,698 | |
 | | MPC508AU/1KG4 | Texas Instruments | IC MUX 8:1 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 25pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 1,124 | |
 | | MPC508AUG4 | Texas Instruments | IC MUX 8:1 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 25pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 572 | |
 | | MPC509AP | Texas Instruments | IC SWITCH SP4T X 2 1.5KOHM 16DIP | Analog Switches, Multiplexers, Demultiplexers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 4:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 12pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300″”, 7.62mm) Supplier Device Package: 16-PDIP | 396 | |
 | | MPC509AU | Texas Instruments | IC SWITCH SP4TX2 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 4:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 12pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 610 | |
 | | MPC509AU/1K | Texas Instruments | IC SWITCH SP4TX2 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 4:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 12pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 1,162 | |
 | | MPC509AU/1KG4 | Texas Instruments | IC SWITCH SP4TX2 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 4:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 12pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 729 | |
 | | MPC509AUG4 | Texas Instruments | IC SWITCH SP4TX2 1.5KOHM 16SOIC | Analog Switches, Multiplexers, Demultiplexers | 16-SOIC | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 4:1 On-State Resistance (Max): 1.5kOhm Voltage – Supply, Dual (V±): ±5V ~ 22V Switch Time (Ton, Toff) (Max): 200ns, 250ns (Typ) Channel Capacitance (CS(off), CD(off)): 5pF, 12pF Current – Leakage (IS(off)) (Max): 500pA (Typ) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295″”, 7.50mm Width) Supplier Device Package: 16-SOIC | 804 | |
 | | MPC5121VY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 115 | |
 | | MPC5121YVY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 738 | |
 | | MPC5123VY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 904 | |
 | | MPC5123YVY400B | NXP Semiconductors | IC MCU 32BIT ROMLESS 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 511 | |
 | | MPC5125YVN400 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 607 | |
 | | MPC5125YVN400R | NXP Semiconductors | IC MCU 32BIT ROMLESS 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,198 | |
 | | MPC5200BV400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 459 | |
 | | MPC5200CBV266 | NXP Semiconductors | IC MPU MPC52XX 266MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,697 | |
 | | MPC5200CBV400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 86 | |
 | | MPC5200CVR266 | NXP Semiconductors | IC MPU MPC52XX 266MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 417 | |