Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MMC2113CFCPV33MMC2113CFCPV33NXP SemiconductorsIC MCU 32BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M210
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,684
MMC2114CFCAG33MMC2114CFCAG33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M210
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,252
MMC2114CFCPU33MMC2114CFCPU33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M210
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,922
MMC2114CFCPV33MMC2114CFCPV33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M210
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
915
MMC2114CFCVF33MMC2114CFCVF33NXP SemiconductorsIC MCU 32B 256KB FLASH 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
M210
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
415
MN101CF49KXNMN101CF49KXNPanasonic Electronic ComponentsIC MCU 8BIT 224KB FLASH 100QFPMicrocontrollers100-QFP (18x18)N/A-40°C ~ 85°C (TA)
Core Processor:
MN101C
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
73
Program Memory Size:
224KB (224K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (18×18)
Package / Case:
100-BQFP
789
MN101CF77GXNMN101CF77GXNPanasonic Electronic ComponentsIC MCU 8BIT 128KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
MN101C
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
1,595
MN101CF78AXNMN101CF78AXNPanasonic Electronic ComponentsIC MCU 8BIT 32KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
MN101C
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, UART/USART
Peripherals:
LCD, PWM, WDT
Number of I/O:
39
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1.5K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
612
MN101LR04DXWMN101LR04DXWPanasonic Electronic ComponentsIC MCU 8BIT 64KB RERAM 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
AM13L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
I2C, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
ReRAM
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
35
MN101LR05DXWMN101LR05DXWPanasonic Electronic ComponentsIC MCU 8BIT 64KB RERAM 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
AM13L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
I2C, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
ReRAM
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
204
MPC506APMPC506APTexas InstrumentsIC MUX 16:1 1.5KOHM 28DIPAnalog Switches, Multiplexers, Demultiplexers28-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 50pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-DIP (0.600″”, 15.24mm)
Supplier Device Package:
28-PDIP
1,426
MPC506APG4MPC506APG4Texas InstrumentsIC MUX 16:1 1.5KOHM 28DIPAnalog Switches, Multiplexers, Demultiplexers28-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 50pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-DIP (0.600″”, 15.24mm)
Supplier Device Package:
28-PDIP
486
MPC506AUMPC506AUTexas InstrumentsIC MUX 16:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 50pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
958
MPC506AU/1KMPC506AU/1KTexas InstrumentsIC MUX 16:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 50pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
1,046
MPC506AUG4MPC506AUG4Texas InstrumentsIC MUX 16:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 50pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
325
MPC507APMPC507APTexas InstrumentsIC MUX DUAL 8:1 1.5KOHM 28DIPAnalog Switches, Multiplexers, Demultiplexers28-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-DIP (0.600″”, 15.24mm)
Supplier Device Package:
28-PDIP
1,176
MPC507APG4MPC507APG4Texas InstrumentsIC MUX DUAL 8:1 1.5KOHM 28DIPAnalog Switches, Multiplexers, Demultiplexers28-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-DIP (0.600″”, 15.24mm)
Supplier Device Package:
28-PDIP
1,139
MPC507AUMPC507AUTexas InstrumentsIC MUX DUAL 8:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
922
MPC507AU/1KMPC507AU/1KTexas InstrumentsIC MUX DUAL 8:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
257
MPC507AUG4MPC507AUG4Texas InstrumentsIC MUX DUAL 8:1 1.5KOHM 28SOICAnalog Switches, Multiplexers, Demultiplexers28-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
1.5kOhm
Voltage – Supply, Dual (V±):
±5V ~ 22V
Switch Time (Ton, Toff) (Max):
200ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA (Typ)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
28-SOIC
547

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